LFEC10E-3F256C

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Mfr.Part #
LFEC10E-3F256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 195 I/O 256FBGA
Stock
8,949
In Stock :
8,949

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
ECCN Code :
EAR99
Width :
17mm
Terminal Pitch :
1mm
Packaging :
Tray
Pbfree Code :
No
HTS Code :
8542.39.00.01
Length :
17mm
Terminal Finish :
Tin/Lead (Sn63Pb37)
Operating Supply Voltage :
1.2V
Max Frequency :
340MHz
Number of Logic Elements/Cells :
10200
Total RAM Bits :
282624
Combinatorial Delay of a CLB-Max :
0.56 ns
Terminal Form :
Ball
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Number of Pins :
256
Peak Reflow Temperature (Cel) :
225
Memory Size :
39.6kB
Number of Logic Blocks (LABs) :
1280
Voltage - Supply :
1.14V~1.26V
Number of I/O :
195
Number of Terminations :
256
Power Supplies :
1.21.2/3.33.3V
Number of Outputs :
195
Lead Free :
Lead Free
JESD-609 Code :
e0
Time@Peak Reflow Temperature-Max (s) :
30
Qualification Status :
Not Qualified
Series :
EC
Published :
2004
Base Part Number :
LFEC10
Terminal Position :
BOTTOM
Reach Compliance Code :
not_compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
256-BGA
Operating Temperature :
0°C~85°C TJ
Pin Count :
256
Mount :
Surface Mount
Height Seated (Max) :
2.1mm
RAM Size :
34.5kB
Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
LFEC10E-3F256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC10E-3F256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:256, Number of Terminations:256, Base Part Number:LFEC10, Package / Case:256-BGA, Operating Temperature:0°C~85°C TJ, LFEC10E-3F256C pinout, LFEC10E-3F256C datasheet PDF, LFEC10E-3F256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC10E-3F256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC10E-3F256C


FPGAs Lattice Semiconductor LFEC10E-3F256C Overview

The Lattice Semiconductor LFEC10E-3F256C FPGA represents a superior blend of utility and performance in the field of programmable logic devices. Designed for versatile applications, this FPGA from Lattice Semiconductor features a compact 256FBGA (Fine Pitch Ball Grid Array) package, making it suitable for dense board layouts where space is at a premium. With 195 I/Os, it provides ample connectivity for various peripheral integrations, supporting complex digital systems. The FPGA’s robust design and adaptive configuration abilities make it ideal for developers looking to customize their applications, providing both flexibility and power efficiency.

LFEC10E-3F256C Features

This FPGA module offers essential characteristics that are critical for high-performance computing tasks in a variety of settings. Key features of the LFEC10E-3F256C include:

  • High I/O count (195 I/O pins) for versatile peripheral connections and system expansions.
  • Compact 256FBGA package, optimized for reduced space consumption on PCBs.
  • Flexible programmability to cater to specific application needs, enhancing system efficiency and performance.
  • Robust design suitable for industrial-grade applications requiring high reliability and durability.

LFEC10E-3F256C Applications

  • Consumer Electronics: Utilized in devices like smart TVs and gaming consoles where multiple input/output connections are essential for enhanced functionality.
  • Automotive Systems: Can be integrated into automotive infotainment systems, aiding in managing complex user interfaces and connectivity solutions.
  • Industrial Automation: Serves as a control unit in automated machinery, providing the necessary computing power and I/O capabilities to handle multiple control tasks simultaneously.
  • Telecommunications: Ideal for use in communication infrastructure, supporting the management of data flow and signal processing.
  • Healthcare Devices: Applied in medical imaging systems, where high data throughput and precise control over processing tasks are paramount.
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