LFECP33E-3FN484C

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Mfr.Part #
LFECP33E-3FN484C
Manufacturer
Lattice Semiconductor
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 360 I/O 484FBGA
Stock
37,597
In Stock :
37,597

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Max Frequency :
340MHz
Series :
ECP
Base Part Number :
LFECP33
Packaging :
Tray
Lead Free :
Lead Free
HTS Code :
8542.39.00.01
Voltage - Supply :
1.14V~1.26V
Published :
2000
RAM Size :
53kB
ECCN Code :
EAR99
Number of Pins :
484
Pbfree Code :
yes
Mounting Type :
Surface Mount
Operating Supply Voltage :
1.2V
Package / Case :
484-BBGA
Number of I/O :
360
Operating Temperature :
0°C~85°C TJ
Pin Count :
484
Number of Logic Elements/Cells :
32800
Number of Logic Blocks (LABs) :
4096
Memory Size :
78.6kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Total RAM Bits :
434176
RoHS Status :
RoHS Compliant
Datasheets
LFECP33E-3FN484C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFECP33E-3FN484C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFECP33, Number of Pins:484, Mounting Type:Surface Mount, Package / Case:484-BBGA, Operating Temperature:0°C~85°C TJ, LFECP33E-3FN484C pinout, LFECP33E-3FN484C datasheet PDF, LFECP33E-3FN484C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFECP33E-3FN484C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFECP33E-3FN484C


FPGAs Lattice Semiconductor LFECP33E-3FN484C Overview

The Lattice Semiconductor LFECP33E-3FN484C FPGA is a high-performance, field-programmable gate array that provides a versatile platform for a wide array of applications. This advanced FPGA offers a robust blend of power, flexibility, and cost-effectiveness, making it an ideal choice for designers looking to leverage the best of technology without compromising on scalability. The LFECP33E-3FN484C is equipped with 360 input/output ports housed in a compact 484-ball fine pitch ball grid array (FBGA) package, enabling dense and efficient system designs. This component is designed to meet the needs of sophisticated digital systems requiring high-speed data processing and high-volume data management, making it a cornerstone in the development of next-generation electronic devices.

LFECP33E-3FN484C Features

This FPGA from Lattice Semiconductor features 360 I/Os, providing ample connectivity for complex digital interactions in multi-functional devices. The 484FBGA packaging ensures a minimal footprint on system boards, which is essential for modern, compact device architectures. High integration capabilities allow for reduced development time and enhanced product performance, facilitating advanced system-on-chip (SoC) designs and the integration of multiple functionalities into a single chip.

LFECP33E-3FN484C Applications

  • Telecommunications Infrastructure: The LFECP33E-3FN484C can be used to facilitate high-speed signal processing tasks within networking equipment, improving data throughput and reliability in complex telecom systems.
  • Consumer Electronics: Ideal for use in high-performance consumer electronics, such as gaming consoles and high-definition video systems, where rapid data processing and enhanced graphical capabilities are required.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple data inputs from various sensors, aiding in real-time decision-making and vehicle automation.
  • Industrial Automation: Can be integrated into control systems for manufacturing lines, providing the computational power needed for real-time machine control and monitoring, enhancing efficiency and safety.
  • Medical Devices: Applied in the development of medical imaging systems, such as MRI and ultrasound scanners, where precise data processing is critical for accurate diagnostics.
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