LFECP10E-3QN208C
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- Mfr.Part #
- LFECP10E-3QN208C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 208-BFQFP
- Datasheet
- Download
- Description
- IC FPGA 147 I/O 208QFP
- Stock
- 40,619
- In Stock ：
- 40,619
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 4.1mm
- Published :
- 2000
- Supply Voltage :
- 1.2V
- Mount :
- Surface Mount
- Number of Logic Elements/Cells :
- 10200
- Number of I/O :
- 147
- Total RAM Bits :
- 282624
- Pin Count :
- 208
- Combinatorial Delay of a CLB-Max :
- 0.56 ns
- ECCN Code :
- EAR99
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Finish :
- Matte Tin (Sn)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- RoHS Compliant
- Package / Case :
- 208-BFQFP
- Length :
- 28mm
- Peak Reflow Temperature (Cel) :
- 245
- Power Supplies :
- 1.21.2/3.33.3V
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Number of Logic Blocks (LABs) :
- 1275
- JESD-609 Code :
- e3
- Number of Terminations :
- 208
- Reach Compliance Code :
- Unknown
- Terminal Position :
- QUAD
- Width :
- 28mm
- Terminal Pitch :
- 0.5mm
- Series :
- ECP
- Operating Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Organization :
- 1280 CLBS
- Frequency :
- 340MHz
- Qualification Status :
- Not Qualified
- Terminal Form :
- Gull wing
- RAM Size :
- 34.5kB
- Pbfree Code :
- yes
- Lead Free :
- Lead Free
- Base Part Number :
- LFECP10
- Memory Size :
- 39.6kB
- HTS Code :
- 8542.39.00.01
- Number of Pins :
- 208
- Number of CLBs :
- 1280
- Number of Outputs :
- 147
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 1.14V~1.26V
- Datasheets
- LFECP10E-3QN208C
1.2V V 4.1mm mm 39.6kB B FPGAs ECP Series 340MHz MHz 208-BFQFP 0.5mm mm 208
LFECP10E-3QN208C Overview
In the package 208-BFQFP, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 147 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 10200 logic elements/cells. Supply voltage is 1.2V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. This is a type of FPGA that is part of the ECP series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 147 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 208. Fpga electronics is worth mentioning that this device provides 282624 bfpga electronics s of RAM. LFECP10 is the base part number that can be used to identify related parts. The RAM si34.5kBe of this FPGA module reaches 34.5kB so as to guarantee the normal operation of the program during operation. The device has 208 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. This is a battery operated device that operates on 1.21.2/3.33.3V. I am going to present you with a device that is equipped with 208 pins. 1275 logic blocks (LABs) constitute its basic building block. There is a memory of 39.6kB embedded inside this FPGA module that can be used to store programs and data. The architecture of the system is based on 1280 CLBs. The system operates at a frequency of 340MHz in order to achieve maximum efficiency.
LFECP10E-3QN208C Features
147 I/Os
Up to 282624 RAM bits
208 LABs/CLBs
1275 logic blocks (LABs)
Operating from a frequency of 340MHz
LFECP10E-3QN208C Applications
There are a lot of Lattice Semiconductor Corporation
LFECP10E-3QN208C FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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