LFEC3E-4F256I

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Mfr.Part #
LFEC3E-4F256I
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 160 I/O 256FBGA
Stock
28,087
In Stock :
28,087

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
2.1mm
HTS Code :
8542.39.00.01
JESD-609 Code :
e0
Pin Count :
256
Organization :
384 CLBS
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Max Frequency :
378MHz
Base Part Number :
LFEC3
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
Pbfree Code :
No
Voltage - Supply :
1.14V~1.26V
Number of CLBs :
384
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Series :
EC
Total RAM Bits :
56320
ECCN Code :
EAR99
Number of Logic Elements/Cells :
3100
Terminal Position :
BOTTOM
Package / Case :
256-BGA
Packaging :
Tray
RAM Size :
6.9kB
Number of Outputs :
160
Published :
2008
Supply Voltage :
1.2V
Peak Reflow Temperature (Cel) :
225
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Number of Terminations :
256
Reach Compliance Code :
not_compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
17mm
Memory Size :
8.4kB
Mount :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.48 ns
Lead Free :
Lead Free
Length :
17mm
Operating Supply Voltage :
1.2V
Number of I/O :
160
Number of Pins :
256
Power Supplies :
1.21.2/3.33.3V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Datasheets
LFEC3E-4F256I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC3E-4F256I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFEC3, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:256-BGA, Number of Terminations:256, Number of Pins:256, LFEC3E-4F256I pinout, LFEC3E-4F256I datasheet PDF, LFEC3E-4F256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC3E-4F256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC3E-4F256I


FPGAs Lattice Semiconductor LFEC3E-4F256I Overview

The FPGAs Lattice Semiconductor LFEC3E-4F256I is a highly versatile and powerful Field Programmable Gate Array (FPGA) designed for advanced digital circuit development. Manufactured by Lattice Semiconductor, a leader in smart connectivity solutions, this IC offers a robust platform for designing and deploying complex digital systems. Its 256FBGA package ensures a compact form factor while supporting a substantial number of I/O options, accommodating 160 inputs/outputs, making it ideal for applications requiring high-density integration and flexibility. This product’s architecture is specifically engineered to meet the evolving needs of modern technology sectors, providing the reliability and performance required to handle sophisticated digital computations and signal processing tasks.

LFEC3E-4F256I Features

The LFEC3E-4F256I FPGA is packed with features designed for efficiency and adaptability. Key features include its 256-ball fine pitch ball grid array (FBGA) package, which maximizes board space efficiency. Additionally, the device supports a wide range of logic density options, facilitating various degrees of complexity in custom logic circuits. The 160 I/O pins offer extensive connectivity, supporting multiple configuration schemes and allowing for versatile hardware integration. This FPGA is optimized for low power consumption, making it suitable for energy-sensitive applications while maintaining high performance.

LFEC3E-4F256I Applications

  • Consumer Electronics: Used in devices like smart TVs and gaming consoles, where its ability to rapidly process multiple inputs and outputs enhances user experience and device functionality.
  • Automotive Systems: Integrated into automotive infotainment and advanced driver-assistance systems (ADAS), providing the necessary computational power and connectivity to support real-time processing and decision-making.
  • Industrial Automation: Plays a critical role in control systems and robotic applications, where reliability and adaptability to varying conditions are paramount.
  • Communication Infrastructure: Utilized in communication equipment such as routers and switchers, where high-speed signal processing and data flow management are crucial for efficient network performance.
  • Medical Devices: Applied in medical imaging systems and diagnostic instruments, enabling complex signal processing tasks that are essential for high-resolution images and accurate diagnostics.
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