LFEC3E-3FN256C
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- Mfr.Part #
- LFEC3E-3FN256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 160 I/O 256FBGA
- Stock
- 4,071
- In Stock ：
- 4,071
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supplier Device Package :
- 256-FPBGA (17x17)
- Max Supply Voltage :
- 1.26V
- Number of I/O :
- 160
- Min Operating Temperature :
- -40°C
- Mounting Type :
- Surface Mount
- Lead Free :
- Lead Free
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Supply Voltage :
- 1.2V
- Max Operating Temperature :
- 85°C
- Operating Temperature :
- 0°C~85°C TJ
- Mount :
- Surface Mount
- Packaging :
- Tray
- Memory Size :
- 8.4kB
- Total RAM Bits :
- 56320
- Series :
- EC
- Max Frequency :
- 340MHz
- RoHS Status :
- RoHS Compliant
- Published :
- 2008
- RAM Size :
- 6.8kB
- Number of Gates :
- 3100
- Package / Case :
- 256-BGA
- Number of Logic Elements/Cells :
- 3100
- Min Supply Voltage :
- 1.14V
- Base Part Number :
- LFEC3
- Number of Logic Blocks (LABs) :
- 384
- Voltage - Supply :
- 1.14V~1.26V
- Frequency :
- 340MHz
- Number of Pins :
- 256
- Datasheets
- LFEC3E-3FN256C
FPGAs Lattice Semiconductor LFEC3E-3FN256C Overview
The FPGAs Lattice Semiconductor LFEC3E-3FN256C is a highly versatile and efficient Field Programmable Gate Array (FPGA) designed to meet the needs of a wide range of high-performance applications. Manufactured by Lattice Semiconductor, this FPGA features a robust 256FBGA package that optimizes board space and enhances device performance through better heat dissipation and electrical integrity. With 160 I/O pins, it offers ample connectivity for complex digital systems, making it an ideal choice for designers looking to develop scalable and flexible solutions in competitive markets.
LFEC3E-3FN256C Features
The LFEC3E-3FN256C FPGA from Lattice Semiconductor is equipped with a rich set of features designed for adaptability and performance. It supports a variety of design implementations, thanks to its flexible logic architecture and the ability to reprogram logic paths dynamically. The integration in a compact 256FBGA package ensures minimal footprint and significant reduction in signal integrity issues, which is critical for high-speed digital processing. Moreover, its high I/O count facilitates extensive interfacing capabilities, essential for handling multiple data streams in real-time applications.
LFEC3E-3FN256C Applications
- Communications Equipment: Used in routers, switches, and other network devices to provide flexible, high-speed data handling and throughput capabilities.
- Consumer Electronics: Integrates into devices such as smart TVs and gaming consoles to manage complex user interfaces and multimedia processing tasks.
- Automotive Systems: Applied in driver assistance systems and infotainment modules to perform real-time data processing and control.
- Industrial Automation: Utilized in control systems for real-time monitoring and management of industrial processes.
- Medical Devices: Helps in the development of diagnostic and imaging equipment by facilitating rapid data analysis and processing.
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