LFEC33E-3F484I

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Mfr.Part #
LFEC33E-3F484I
Manufacturer
Lattice Semiconductor
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 360 I/O 484FBGA
Stock
16,892
In Stock :
16,892

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Power Supplies :
1.21.2/3.33.3V
Terminal Pitch :
1mm
Voltage - Supply :
1.14V~1.26V
Height Seated (Max) :
2.6mm
Published :
2000
Number of Terminations :
484
Peak Reflow Temperature (Cel) :
225
Mount :
Surface Mount
Terminal Form :
Ball
ECCN Code :
EAR99
Time@Peak Reflow Temperature-Max (s) :
30
Number of Logic Blocks (LABs) :
4096
Max Frequency :
340MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Reach Compliance Code :
not_compliant
Base Part Number :
LFEC33
Operating Temperature :
-40°C~100°C TJ
Terminal Position :
BOTTOM
RoHS Status :
Non-RoHS Compliant
Total RAM Bits :
434176
Memory Size :
78.6kB
Length :
23mm
RAM Size :
53kB
Number of I/O :
360
Width :
23mm
Packaging :
Tray
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Lead (Sn/Pb)
Qualification Status :
Not Qualified
JESD-609 Code :
e0
Number of Pins :
484
Series :
EC
Number of Outputs :
360
Package / Case :
484-BBGA
Lead Free :
Lead Free
Operating Supply Voltage :
1.2V
Pin Count :
484
Mounting Type :
Surface Mount
Supply Voltage :
1.2V
Combinatorial Delay of a CLB-Max :
0.56 ns
Pbfree Code :
No
Number of Logic Elements/Cells :
32800
HTS Code :
8542.39.00.01
Datasheets
LFEC33E-3F484I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC33E-3F484I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:484, Base Part Number:LFEC33, Operating Temperature:-40°C~100°C TJ, Number of Pins:484, Package / Case:484-BBGA, Mounting Type:Surface Mount, LFEC33E-3F484I pinout, LFEC33E-3F484I datasheet PDF, LFEC33E-3F484I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC33E-3F484I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC33E-3F484I


FPGAs Lattice Semiconductor LFEC33E-3F484I Overview

Introducing the LFEC33E-3F484I from Lattice Semiconductor, a state-of-the-art FPGA (Field Programmable Gate Array) designed to deliver superior performance and flexibility. This component is engineered to meet the increasing demands of sophisticated electronic systems, offering a robust solution with its 360 I/O packaged in a compact 484FBGA format. The FPGAs Lattice Semiconductor LFEC33E-3F484I is ideal for developers looking for a scalable and efficient FPGA capable of supporting complex logic operations and data processing in a variety of applications. Its adaptability and performance parameters make it an essential choice for high-demand environments, ensuring reliability and high functionality.

LFEC33E-3F484I Features

The LFEC33E-3F484I FPGA boasts several features that stand out in the tech industry. It provides 360 input/output options that enable extensive connectivity and integration capabilities. Housed in a 484-pin fine-pitch ball grid array (FBGA), this FPGA offers a compact form factor without compromising on the accessibility of its pins. This design ensures optimal electrical performance and enhanced thermal management, crucial for maintaining functionality and longevity in rigorous operational conditions.

LFEC33E-3F484I Applications

  • Telecommunications: Utilized in network infrastructure to manage signal processing and data flow, enhancing communication reliability and speed.
  • Automotive Systems: Integrated into driver assistance systems where quick data processing is crucial for real-time decision-making and vehicle safety enhancements.
  • Consumer Electronics: Applied in devices like smart TVs and gaming consoles, improving processing capabilities and supporting advanced user interfaces and high-resolution graphics.
  • Industrial Automation: Employed in control systems to facilitate complex manufacturing processes through precise control and automation capabilities.
  • Medical Devices: Critical in medical imaging systems, where high-speed data processing and real-time analysis are necessary for accurate diagnostics.
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