LFEC20E-5FN672C

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Mfr.Part #
LFEC20E-5FN672C
Manufacturer
Lattice Semiconductor
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 400 I/O 672FPBGA
Stock
30,271
In Stock :
30,271

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Memory Size :
62.9kB
Height Seated (Max) :
2.6mm
Terminal Position :
BOTTOM
Operating Temperature :
0°C~85°C TJ
RoHS Status :
RoHS Compliant
Terminal Form :
Ball
Number of Outputs :
400
ECCN Code :
EAR99
Frequency :
420MHz
Width :
27mm
Series :
EC
RAM Size :
53kB
Number of Logic Elements/Cells :
19700
Base Part Number :
LFEC20
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
1.21.2/3.33.3V
Terminal Pitch :
1mm
Combinatorial Delay of a CLB-Max :
0.4 ns
Time@Peak Reflow Temperature-Max (s) :
40
Lead Free :
Lead Free
Peak Reflow Temperature (Cel) :
250
Length :
27mm
Voltage - Supply :
1.14V~1.26V
Number of I/O :
400
Published :
2000
Pbfree Code :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
672-BBGA
JESD-609 Code :
e1
Number of Logic Blocks (LABs) :
2464
Number of Terminations :
672
Total RAM Bits :
434176
Mount :
Surface Mount
Pin Count :
672
Supply Voltage :
1.2V
Number of Pins :
672
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Qualification Status :
Not Qualified
Operating Supply Voltage :
1.2V
HTS Code :
8542.39.00.01
Packaging :
Tray
Datasheets
LFEC20E-5FN672C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC20E-5FN672C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:LFEC20, Mounting Type:Surface Mount, Package / Case:672-BBGA, Number of Terminations:672, Number of Pins:672, LFEC20E-5FN672C pinout, LFEC20E-5FN672C datasheet PDF, LFEC20E-5FN672C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC20E-5FN672C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC20E-5FN672C


FPGAs Lattice Semiconductor LFEC20E-5FN672C Overview

The Lattice Semiconductor LFEC20E-5FN672C FPGA is a high-performance, field-programmable gate array designed for advanced applications that require robust functionality within a compact 672-ball fine-pitch BGA (FPBGA) package. As an integral component of modern electronic design, this FPGA offers a flexible solution for designers aiming to accelerate time-to-market while achieving cost efficiencies at scale. The capability to reprogram the logic provides unmatched versatility in accommodating updates and changes without needing hardware replacements, making the FPGAs Lattice Semiconductor LFEC20E-5FN672C an ideal choice for dynamic and evolving technological landscapes.

LFEC20E-5FN672C Features

This FPGA features a substantial array of 400 user-programmable I/Os which facilitates extensive interfacing with a wide range of peripheral devices. With its high-density logic capacity, the LFEC20E-5FN672C supports complex digital computations and algorithm implementations, crucial for high-throughput applications. The device's architecture is optimized for low power consumption, yet it maintains high performance, providing an ideal balance for power-sensitive applications.

LFEC20E-5FN672C Applications

  • Telecommunications: In telecom infrastructure, the LFEC20E-5FN672C can be used to manage signal processing tasks, adapting to various protocols and modulation schemes.
  • Automotive Systems: This FPGA is utilized in vehicle electronics for controlling and managing sensor inputs, engine control units (ECUs), and advanced driver-assistance systems (ADAS), ensuring high reliability and responsiveness.
  • Consumer Electronics: Suitable for integration in smart home devices and multimedia systems, providing the necessary processing power for device control and user interface enhancements.
  • Industrial Automation: In industrial settings, the FPGA enables complex machine control algorithms and real-time data processing for robotics and automated assembly lines.
  • Medical Devices: It supports the demands of medical imaging and diagnostic systems by handling high-speed data acquisition and real-time image processing tasks.
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