LFEC10E-4QN208I

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Mfr.Part #
LFEC10E-4QN208I
Manufacturer
Lattice Semiconductor
Package / Case
208-BFQFP
Datasheet
Download
Description
IC FPGA 147 I/O 208QFP
Stock
38,102
In Stock :
38,102

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Mount :
Surface Mount
Packaging :
Tray
Operating Supply Voltage :
1.2V
Terminal Position :
QUAD
Mounting Type :
Surface Mount
Memory Size :
39.6kB
Voltage - Supply :
1.14V~1.26V
Number of Pins :
208
Combinatorial Delay of a CLB-Max :
0.48 ns
Supply Voltage :
1.2V
Number of Logic Blocks (LABs) :
1275
Length :
28mm
Terminal Finish :
Matte Tin (Sn)
Base Part Number :
LFEC10
Terminal Form :
Gull wing
Number of CLBs :
1280
RAM Size :
34.5kB
Pin Count :
208
Total RAM Bits :
282624
Operating Temperature :
-40°C~100°C TJ
RoHS Status :
RoHS Compliant
Number of Logic Elements/Cells :
10200
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
4.1mm
Number of Terminations :
208
Organization :
1280 CLBS
Width :
28mm
Series :
EC
Time@Peak Reflow Temperature-Max (s) :
40
Number of Outputs :
147
Package / Case :
208-BFQFP
Qualification Status :
Not Qualified
Terminal Pitch :
0.5mm
Power Supplies :
1.21.2/3.33.3V
Reach Compliance Code :
Unknown
Max Frequency :
378MHz
Pbfree Code :
yes
Number of I/O :
147
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
245
Lead Free :
Lead Free
JESD-609 Code :
e3
Datasheets
LFEC10E-4QN208I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC10E-4QN208I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:208, Base Part Number:LFEC10, Operating Temperature:-40°C~100°C TJ, Number of Terminations:208, Package / Case:208-BFQFP, LFEC10E-4QN208I pinout, LFEC10E-4QN208I datasheet PDF, LFEC10E-4QN208I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC10E-4QN208I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC10E-4QN208I


FPGAs Lattice Semiconductor LFEC10E-4QN208I Overview

The LFEC10E-4QN208I, manufactured by Lattice Semiconductor, represents a sophisticated addition to the field of Field Programmable Gate Arrays (FPGAs). This high-performance integrated circuit is engineered to meet the rigorous demands of modern digital applications, offering a flexible solution for designers looking to harness robust computational power and customization. Enclosed in a 208-pin Quad Flat Pack (QFP), the LFEC10E-4QN208I features a rich array of 147 input/output options, making it immensely versatile for a wide range of applications. The FPGAs Lattice Semiconductor LFEC10E-4QN208I is specifically designed for tasks requiring quick prototyping and complex digital computations where flexibility and space are critical considerations.

LFEC10E-4QN208I Features

This FPGA stands out with its impressive configuration, enabling extensive programmability and adaptation in real-time applications. Key features include:

  • High I/O count (147 I/O pins) which provides substantial connectivity for complex digital systems.
  • Compact 208QFP package, optimizing board space without compromising performance.
  • Advanced security features to ensure safe and secure operations in sensitive applications.
  • Low power consumption, making it ideal for energy-efficient designs.

LFEC10E-4QN208I Applications

  • Consumer Electronics: In devices such as smartphones and tablets, the LFEC10E-4QN208I can manage multiple functionalities while maximizing space and energy efficiency.
  • Automotive Systems: This FPGA is utilized in automotive electronics for controlling and processing complex algorithms in real-time vehicle monitoring and safety systems.
  • Industrial Automation: Ideal for control systems in manufacturing processes, this FPGA helps in handling varied control tasks efficiently.
  • Data Processing: Serves robust solutions for data centers requiring high-speed data processing and storage management capabilities.
  • Telecommunications: Supports infrastructure by enhancing signal processing capabilities and network reliability in communication equipment.
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