LFE2M100SE-6FN900C

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Mfr.Part #
LFE2M100SE-6FN900C
Manufacturer
Lattice Semiconductor
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 416 I/O 900FBGA
Stock
42,779
In Stock :
42,779

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Pins :
900
Memory Size :
688.8kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Base Part Number :
LFE2M100
Pin Count :
900
Number of Outputs :
416
Number of Logic Elements/Cells :
95000
Lead Free :
Lead Free
Total RAM Bits :
5435392
JESD-609 Code :
e1
Published :
2012
Packaging :
Tray
RAM Size :
663.5kB
Number of LABs/CLBs :
11875
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code :
8542.39.00.01
Terminal Form :
Ball
Height Seated (Max) :
2.6mm
Reach Compliance Code :
not_compliant
Factory Lead Time :
8 Weeks
ECCN Code :
EAR99
Qualification Status :
Not Qualified
Terminal Position :
BOTTOM
Number of Terminations :
900
Operating Temperature :
0°C~85°C TJ
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Series :
ECP2M
Width :
31mm
Number of Logic Cells :
100000
Package / Case :
900-BBGA
Terminal Pitch :
1mm
RoHS Status :
ROHS3 Compliant
Clock Frequency :
357MHz
Operating Supply Voltage :
1.2V
Length :
31mm
Voltage - Supply :
1.14V~1.26V
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Peak Reflow Temperature (Cel) :
250
Pbfree Code :
yes
Combinatorial Delay of a CLB-Max :
0.331 ns
Supply Voltage :
1.2V
Mount :
Surface Mount
Number of I/O :
416
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M100SE-6FN900C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:900, Base Part Number:LFE2M100, Number of Terminations:900, Operating Temperature:0°C~85°C TJ, Package / Case:900-BBGA, Mounting Type:Surface Mount, LFE2M100SE-6FN900C pinout, LFE2M100SE-6FN900C datasheet PDF, LFE2M100SE-6FN900C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M100SE-6FN900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M100SE-6FN900C


FPGAs Lattice Semiconductor LFE2M100SE-6FN900C Overview

The LFE2M100SE-6FN900C, a robust FPGA from Lattice Semiconductor, represents a sophisticated blend of versatility and performance tailored to meet the advanced demands of modern digital applications. This IC FPGA is housed in a 900FBGA package, providing a dense matrix of 416 I/O options that enable substantial flexibility in system design. This product is ideal for designers who require a high-functionality FPGA with a balance of power efficiency, programming simplicity, and ample I/O connectivity, making it an essential component in sophisticated electronic designs.

LFE2M100SE-6FN900C Features

This FPGA stands out with its high I/O count and a compact 900FBGA packaging that facilitates dense circuit designs without sacrificing performance and space. The ability to support various logic operations due to its adaptable architecture allows it to cater to a broad spectrum of functionalities from signal processing to complex logic computations, making it a versatile choice for various applications.

LFE2M100SE-6FN900C Applications

  • Telecommunications Infrastructure: The high I/O count and flexible programmability make the LFE2M100SE-6FN900C ideal for telecommunications hardware, such as routers and switches, enabling robust data handling and signal processing capabilities.
  • Automotive Applications: Suitable for use in advanced driver-assistance systems (ADAS), this FPGA can handle multiple inputs and outputs necessary for processing real-time data from vehicle sensors, enhancing safety and performance.
  • Consumer Electronics: This FPGA can be used in high-performance home entertainment systems, providing the necessary processing power for video and audio signal management, ensuring a high-quality user experience.
  • Industrial Automation: In automation systems, the LFE2M100SE-6FN900C helps manage control processes, sensor arrays, and real-time data analytics, crucial for optimizing manufacturing processes and reducing downtime.
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