IS63LV1024L-12BI

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Mfr.Part #
IS63LV1024L-12BI
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
36-TFBGA
Datasheet
Download
Description
IC SRAM 1MBIT PARALLEL 36MINIBGA
Stock
49,415
In Stock :
49,415

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Width :
8
HTS Code :
8542.32.00.41
Terminal Position :
BOTTOM
Power Supplies :
3.3V
Mounting Type :
Surface Mount
Output Characteristics :
3-STATE
Number of Terminations :
36
Terminal Finish :
Tin/Lead (Sn/Pb)
RoHS Status :
Non-RoHS Compliant
Number of Functions :
1
Supply Voltage-Min (Vsup) :
3.15V
Write Cycle Time - Word, Page :
12ns
JESD-609 Code :
e0
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Supply Voltage :
3.3V
Terminal Pitch :
0.75mm
Access Time (Max) :
12 ns
I/O Type :
COMMON
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Qualification Status :
Not Qualified
Memory Interface :
Parallel
Standby Voltage-Min :
2V
ECCN Code :
3A991.B.2.B
Packaging :
Tray
Standby Current-Max :
0.0015A
Width :
8mm
Supply Current-Max :
0.1mA
Height Seated (Max) :
1.2mm
Memory Density :
1048576 bit
Number of Pins :
36
Memory Format :
SRAM
Operating Temperature :
-40°C~85°C TA
Memory Type :
Volatile
Pbfree Code :
No
Surface Mount :
yes
Package / Case :
36-TFBGA
Memory Size :
1Mb 128K x 8
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Length :
10mm
Voltage - Supply :
3.15V~3.45V
Pin Count :
36
Supply Voltage-Max (Vsup) :
3.45V
Organization :
128KX8
Datasheets
IS63LV1024L-12BI
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS63LV1024L-12BI from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:36, Number of Pins:36, Operating Temperature:-40°C~85°C TA, Package / Case:36-TFBGA, IS63LV1024L-12BI pinout, IS63LV1024L-12BI datasheet PDF, IS63LV1024L-12BI amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS63LV1024L-12BI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS63LV1024L-12BI


Memory Integrated Silicon Solution, Inc. (ISSI) IS63LV1024L-12BI Overview

The IS63LV1024L-12BI, manufactured by Integrated Silicon Solution, Inc. (ISSI), stands out in the market of SRAM technologies. This high-performance IC SRAM of 1Mbit offers robust parallel processing capabilities housed in a compact 36-mini BGA package. Designed to meet the demanding needs of modern electronic applications, the Memory Integrated Silicon Solution, Inc. (ISSI) IS63LV1024L-12BI provides reliable, high-speed data storage and retrieval. This product is an excellent choice for businesses looking to integrate dependable memory solutions into their advanced systems, promising enhanced operational efficiency and reliability.

IS63LV1024L-12BI Features

The IS63LV1024L-12BI SRAM features include a 1Mbit capacity with a parallel interface, providing high-speed access and processing capabilities. Its compact 36-mini BGA packaging ensures a minimal footprint on system boards, making it ideal for space-constrained applications. The chip operates at 12 ns, allowing for quick data retrieval and high throughput for critical applications. The device's low power consumption also makes it suitable for battery-powered or portable devices, enhancing its versatility across various technological fields.

IS63LV1024L-12BI Applications

  • Automotive Systems: Utilized in engine control units and infotainment systems to provide fast and reliable data storage, enhancing the performance and efficiency of automotive applications.
  • Industrial Automation: Plays a critical role in automation controllers and real-time monitoring systems, where speed and data integrity are paramount.
  • Telecommunication Infrastructure: Applied in switches and routers for buffering data, improving bandwidth management and system reliability in communication networks.
  • Consumer Electronics: Essential for enhancing the performance of multimedia devices, gaming consoles, and portable electronics by providing high-speed SRAM for data-intensive operations.
  • Medical Equipment: Used in medical devices that require rapid access to large volumes of data for real-time processing, ensuring quick response times and high reliability.
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