IS61QDP2B22M18A-333M3L
- Mfr.Part #
- IS61QDP2B22M18A-333M3L
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165LFBGA
- Stock
- 36,363
- In Stock :
- 36,363
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Standby Voltage-Min :
- 1.7V
- Factory Lead Time :
- 12 Weeks
- ECCN Code :
- 3A991.B.2.A
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Size :
- 36Mb 2M x 18
- Organization :
- 2MX18
- Voltage - Supply :
- 1.71V~1.89V
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 1.8V
- Power Supplies :
- 1.5/1.81.8V
- Clock Frequency :
- 333MHz
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Standby Current-Max :
- 0.29A
- Width :
- 15mm
- Memory Format :
- SRAM
- Access Time :
- 8.4ns
- Operating Temperature :
- 0°C~70°C TA
- Memory Type :
- Volatile
- Pin Count :
- 165
- Number of Functions :
- 1
- Memory Width :
- 18
- Package / Case :
- 165-LBGA
- Supply Voltage-Max (Vsup) :
- 1.89V
- Length :
- 17mm
- I/O Type :
- Separate
- Supply Voltage-Min (Vsup) :
- 1.71V
- Additional Feature :
- PIPELINED ARCHITECTURE
- Supply Current-Max :
- 1.15mA
- Output Characteristics :
- 3-STATE
- Memory Interface :
- Parallel
- Number of Terminations :
- 165
- Surface Mount :
- yes
- Packaging :
- Tray
- Number of Pins :
- 165
- HTS Code :
- 8542.32.00.41
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 1.4mm
- Terminal Pitch :
- 1mm
- Memory Density :
- 37748736 bit
- Datasheets
- IS61QDP2B22M18A-333M3L
Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDP2B22M18A-333M3L Overview
Discover unparalleled efficiency and reliability with the IS61QDP2B22M18A-333M3L, an exceptional IC SRAM solution meticulously crafted by Integrated Silicon Solution, Inc. (ISSI). This 36MBIT Parallel IC boasts a 165LFBGA form factor, ensuring seamless integration into your circuit designs. Experience lightning-fast data retrieval and storage capabilities, coupled with a robust construction that guarantees long-term performance. Whether you're designing cutting-edge computing systems or high-speed communication devices, this memory IC delivers the power and precision your projects demand.
IS61QDP2B22M18A-333M3L Features
- High Capacity: With a storage capacity of 36MBIT, this IC provides ample space for data-intensive applications.
- Parallel Interface: The parallel interface enables rapid data transfer, ensuring efficient operation in high-performance systems.
- Compact Form Factor: The 165LFBGA package offers a space-saving design without compromising on functionality.
- Low Power Consumption: Despite its impressive performance, this IC maintains low power consumption levels, ideal for energy-efficient designs.
- Robust Construction: Built to withstand demanding environments, this memory IC ensures reliable operation in various industrial applications.
IS61QDP2B22M18A-333M3L Applications
- Embedded Systems: Integrate this IC into embedded systems for efficient data storage and retrieval in applications such as industrial automation and automotive electronics.
- Networking Equipment: Enhance the performance of networking equipment, including routers and switches, by leveraging the high-speed data processing capabilities of this memory IC.
- Telecommunication Devices: Optimize telecommunication devices like base stations and communication servers with the reliable data storage and transfer capabilities of the IS61QDP2B22M18A-333M3L.
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