IS61QDP2B22M18A-333M3L

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Mfr.Part #
IS61QDP2B22M18A-333M3L
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165LFBGA
Stock
36,363
In Stock :
36,363

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Standby Voltage-Min :
1.7V
Factory Lead Time :
12 Weeks
ECCN Code :
3A991.B.2.A
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
36Mb 2M x 18
Organization :
2MX18
Voltage - Supply :
1.71V~1.89V
Qualification Status :
Not Qualified
Supply Voltage :
1.8V
Power Supplies :
1.5/1.81.8V
Clock Frequency :
333MHz
Terminal Position :
BOTTOM
RoHS Status :
ROHS3 Compliant
Standby Current-Max :
0.29A
Width :
15mm
Memory Format :
SRAM
Access Time :
8.4ns
Operating Temperature :
0°C~70°C TA
Memory Type :
Volatile
Pin Count :
165
Number of Functions :
1
Memory Width :
18
Package / Case :
165-LBGA
Supply Voltage-Max (Vsup) :
1.89V
Length :
17mm
I/O Type :
Separate
Supply Voltage-Min (Vsup) :
1.71V
Additional Feature :
PIPELINED ARCHITECTURE
Supply Current-Max :
1.15mA
Output Characteristics :
3-STATE
Memory Interface :
Parallel
Number of Terminations :
165
Surface Mount :
yes
Packaging :
Tray
Number of Pins :
165
HTS Code :
8542.32.00.41
Mounting Type :
Surface Mount
Height Seated (Max) :
1.4mm
Terminal Pitch :
1mm
Memory Density :
37748736 bit
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDP2B22M18A-333M3L from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, Number of Terminations:165, Number of Pins:165, Mounting Type:Surface Mount, IS61QDP2B22M18A-333M3L pinout, IS61QDP2B22M18A-333M3L datasheet PDF, IS61QDP2B22M18A-333M3L amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDP2B22M18A-333M3L ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61QDP2B22M18A-333M3L


Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDP2B22M18A-333M3L Overview

Discover unparalleled efficiency and reliability with the IS61QDP2B22M18A-333M3L, an exceptional IC SRAM solution meticulously crafted by Integrated Silicon Solution, Inc. (ISSI). This 36MBIT Parallel IC boasts a 165LFBGA form factor, ensuring seamless integration into your circuit designs. Experience lightning-fast data retrieval and storage capabilities, coupled with a robust construction that guarantees long-term performance. Whether you're designing cutting-edge computing systems or high-speed communication devices, this memory IC delivers the power and precision your projects demand.

IS61QDP2B22M18A-333M3L Features

  • High Capacity: With a storage capacity of 36MBIT, this IC provides ample space for data-intensive applications.
  • Parallel Interface: The parallel interface enables rapid data transfer, ensuring efficient operation in high-performance systems.
  • Compact Form Factor: The 165LFBGA package offers a space-saving design without compromising on functionality.
  • Low Power Consumption: Despite its impressive performance, this IC maintains low power consumption levels, ideal for energy-efficient designs.
  • Robust Construction: Built to withstand demanding environments, this memory IC ensures reliable operation in various industrial applications.

IS61QDP2B22M18A-333M3L Applications

  • Embedded Systems: Integrate this IC into embedded systems for efficient data storage and retrieval in applications such as industrial automation and automotive electronics.
  • Networking Equipment: Enhance the performance of networking equipment, including routers and switches, by leveraging the high-speed data processing capabilities of this memory IC.
  • Telecommunication Devices: Optimize telecommunication devices like base stations and communication servers with the reliable data storage and transfer capabilities of the IS61QDP2B22M18A-333M3L.
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