IS61QDB22M18C-250M3L

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Mfr.Part #
IS61QDB22M18C-250M3L
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165LFBGA
Stock
33,159
In Stock :
33,159

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Terminal Pitch :
1mm
Memory Density :
37748736 bit
Supply Voltage-Max (Vsup) :
1.89V
Packaging :
Tray
HTS Code :
8542.32.00.41
Clock Frequency :
250MHz
Width :
15mm
Package / Case :
165-LBGA
Length :
17mm
RoHS Status :
ROHS3 Compliant
Access Time :
8.4ns
Height Seated (Max) :
1.4mm
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
JESD-30 Code :
R-PBGA-B165
Memory Interface :
Parallel
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Width :
18
Memory Size :
36Mb 2M x 18
Surface Mount :
yes
Supply Voltage :
1.8V
Memory Type :
Volatile
Voltage - Supply :
1.71V~1.89V
Organization :
2MX18
Memory Format :
SRAM
Operating Temperature :
0°C~70°C TA
ECCN Code :
3A991.B.2.A
Number of Terminations :
165
Supply Voltage-Min (Vsup) :
1.71V
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3L from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Number of Terminations:165, IS61QDB22M18C-250M3L pinout, IS61QDB22M18C-250M3L datasheet PDF, IS61QDB22M18C-250M3L amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3L ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3L


Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3L Overview

The IS61QDB22M18C-250M3L from Integrated Silicon Solution, Inc. (ISSI) is a high-performance SRAM device designed to meet the rigorous demands of sophisticated electronic systems. With a storage capacity of 36Mbit and a parallel interface, this SRAM module ensures rapid data access and high-speed operation, essential for applications requiring quick data buffering and storage. The compact 165LFBGA package guarantees minimized footprint on circuit boards, making it an ideal choice for systems with space constraints. The utilization of advanced fabrication technology enables this Memory component to operate reliably under extensive industrial temperature ranges, ensuring durability and stable performance in critical environments.

IS61QDB22M18C-250M3L Features

This SRAM module offers several features essential for modern electronics development:

  • High data storage capacity of 36Mbit
  • Fast parallel interface for rapid data transfer
  • Compact 165LFBGA packaging for efficient use of PCB space
  • Designed for low-power consumption to extend device longevity
  • Operates across industrial temperature ranges, ensuring reliability under extreme conditions

IS61QDB22M18C-250M3L Applications

  • Advanced Driver Assistance Systems (ADAS): Utilizes the high-speed data buffering capabilities to manage real-time sensor data, enhancing responsiveness and safety features.
  • Networking Equipment: Supports high-bandwidth data processing tasks essential for managing traffic within routers and switches.
  • Industrial Automation: Relies on robust temperature range and fast data access to optimize control systems in manufacturing environments.
  • Medical Imaging Systems: Provides the necessary speed and capacity for handling complex imaging data, crucial for high-resolution diagnostics.
  • Telecommunications: Facilitates fast and reliable data storage for infrastructure supporting increased data throughput and connectivity.
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