IS61NVF102418-6.5B3I

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Mfr.Part #
IS61NVF102418-6.5B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
43,902
In Stock :
43,902

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Power Supplies :
2.5V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Length :
15mm
Terminal Position :
BOTTOM
Surface Mount :
yes
Number of Terminations :
165
Memory Type :
Volatile
Output Characteristics :
3-STATE
Height Seated (Max) :
1.2mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Mounting Type :
Surface Mount
Memory Size :
18Mb 1M x 18
Width :
13mm
Standby Voltage-Min :
2.38V
Number of Pins :
165
HTS Code :
8542.32.00.41
Pin Count :
165
I/O Type :
COMMON
Clock Frequency :
133MHz
Package / Case :
165-TBGA
Terminal Pitch :
1mm
RoHS Status :
ROHS3 Compliant
Terminal Finish :
Tin/Lead (Sn/Pb)
Supply Current-Max :
0.45mA
Memory Format :
SRAM
Operating Temperature :
-40°C~85°C TA
JESD-609 Code :
e0
Additional Feature :
FLOW-THROUGH ARCHITECTURE
Memory Density :
18874368 bit
Packaging :
Tray
Voltage - Supply :
2.375V~2.625V
Supply Voltage-Min (Vsup) :
2.375V
Memory Interface :
Parallel
Memory Width :
18
Pbfree Code :
No
Supply Voltage-Max (Vsup) :
2.625V
Supply Voltage :
2.5V
Access Time :
6.5ns
ECCN Code :
3A991.B.2.A
Qualification Status :
Not Qualified
Number of Functions :
1
Standby Current-Max :
0.075A
Organization :
1MX18
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Mounting Type:Surface Mount, Number of Pins:165, Package / Case:165-TBGA, Operating Temperature:-40°C~85°C TA, IS61NVF102418-6.5B3I pinout, IS61NVF102418-6.5B3I datasheet PDF, IS61NVF102418-6.5B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3I Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3I is a cutting-edge SRAM chip designed for high-speed and high-capacity storage solutions. With an impressive 18Mbit storage capacity and a compact 165TFBGA package, this memory module is engineered to meet the rigorous demands of advanced computing and digital storage systems. Its parallel interface ensures rapid data access and transfer speeds, making it an ideal component for applications requiring quick data retrieval and real-time processing. The use of advanced fabrication technology ensures that this SRAM module not only delivers exceptional performance but also maintains high reliability and power efficiency in challenging environments.

IS61NVF102418-6.5B3I Features

  • 18Mbit high-capacity storage
  • Parallel interface for fast data transfer
  • Compact 165TFBGA packaging for space-efficient design
  • High reliability and durability under varying environmental conditions
  • Optimized power efficiency for sustainable performance

IS61NVF102418-6.5B3I Applications

  • Networking Equipment: Utilized in routers and switches for buffer memory to manage data flow efficiently.
  • Telecommunications Systems: Serves as temporary storage for data being processed in telecommunications infrastructure.
  • Industrial Automation: Plays a crucial role in programmable logic controllers (PLCs) where fast data access is essential for real-time system response.
  • Automotive Electronics: Used in automotive systems for data logging and real-time sensor data processing.
  • Consumer Electronics: Integrated into devices like set-top boxes and gaming consoles for enhanced performance and speed.
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Shipping Cost

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