IS61NVF102418-6.5B3I
- Mfr.Part #
- IS61NVF102418-6.5B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 43,902
- In Stock :
- 43,902
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Power Supplies :
- 2.5V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Length :
- 15mm
- Terminal Position :
- BOTTOM
- Surface Mount :
- yes
- Number of Terminations :
- 165
- Memory Type :
- Volatile
- Output Characteristics :
- 3-STATE
- Height Seated (Max) :
- 1.2mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Memory Size :
- 18Mb 1M x 18
- Width :
- 13mm
- Standby Voltage-Min :
- 2.38V
- Number of Pins :
- 165
- HTS Code :
- 8542.32.00.41
- Pin Count :
- 165
- I/O Type :
- COMMON
- Clock Frequency :
- 133MHz
- Package / Case :
- 165-TBGA
- Terminal Pitch :
- 1mm
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Supply Current-Max :
- 0.45mA
- Memory Format :
- SRAM
- Operating Temperature :
- -40°C~85°C TA
- JESD-609 Code :
- e0
- Additional Feature :
- FLOW-THROUGH ARCHITECTURE
- Memory Density :
- 18874368 bit
- Packaging :
- Tray
- Voltage - Supply :
- 2.375V~2.625V
- Supply Voltage-Min (Vsup) :
- 2.375V
- Memory Interface :
- Parallel
- Memory Width :
- 18
- Pbfree Code :
- No
- Supply Voltage-Max (Vsup) :
- 2.625V
- Supply Voltage :
- 2.5V
- Access Time :
- 6.5ns
- ECCN Code :
- 3A991.B.2.A
- Qualification Status :
- Not Qualified
- Number of Functions :
- 1
- Standby Current-Max :
- 0.075A
- Organization :
- 1MX18
- Datasheets
- IS61NVF102418-6.5B3I
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3I Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3I is a cutting-edge SRAM chip designed for high-speed and high-capacity storage solutions. With an impressive 18Mbit storage capacity and a compact 165TFBGA package, this memory module is engineered to meet the rigorous demands of advanced computing and digital storage systems. Its parallel interface ensures rapid data access and transfer speeds, making it an ideal component for applications requiring quick data retrieval and real-time processing. The use of advanced fabrication technology ensures that this SRAM module not only delivers exceptional performance but also maintains high reliability and power efficiency in challenging environments.
IS61NVF102418-6.5B3I Features
- 18Mbit high-capacity storage
- Parallel interface for fast data transfer
- Compact 165TFBGA packaging for space-efficient design
- High reliability and durability under varying environmental conditions
- Optimized power efficiency for sustainable performance
IS61NVF102418-6.5B3I Applications
- Networking Equipment: Utilized in routers and switches for buffer memory to manage data flow efficiently.
- Telecommunications Systems: Serves as temporary storage for data being processed in telecommunications infrastructure.
- Industrial Automation: Plays a crucial role in programmable logic controllers (PLCs) where fast data access is essential for real-time system response.
- Automotive Electronics: Used in automotive systems for data logging and real-time sensor data processing.
- Consumer Electronics: Integrated into devices like set-top boxes and gaming consoles for enhanced performance and speed.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
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