IS61NLP102418-250B3I

Manufacturer :

Integrated Silicon Solution, Inc. (ISSI)

Product Category :

Memory

Additional Feature :

PIPELINED ARCHITECTURE

Output Characteristics :

3-STATE

Package / Case :

165-TBGA

Number of Terminations :

165

RoHS Status :

ROHS3 Compliant

Clock Frequency :

250MHz

ECCN Code :

3A991.B.2.A

Access Time :

2.6ns

Terminal Finish :

Tin/Lead (Sn/Pb)

I/O Type :

COMMON

Mounting Type :

Surface Mount

Terminal Pitch :

1mm

Standby Voltage-Min :

3.14V

Memory Type :

Volatile

Pin Count :

165

Surface Mount :

yes

Memory Size :

18Mb 1M x 18

Memory Interface :

Parallel

Supply Voltage-Max (Vsup) :

3.465V

Number of Pins :

165

HTS Code :

8542.32.00.41

Pbfree Code :

No

Voltage - Supply :

3.135V~3.465V

Packaging :

Tray

Memory Width :

18

Height Seated (Max) :

1.2mm

Length :

15mm

Qualification Status :

Not Qualified

Standby Current-Max :

0.075A

JESD-609 Code :

e0

Operating Temperature :

-40°C~85°C TA

Organization :

1MX18

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Voltage-Min (Vsup) :

3.135V

Memory Format :

SRAM

Width :

13mm

Power Supplies :

2.5/3.33.3V

Supply Current-Max :

0.5mA

Memory Density :

18874368 bit

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Position :

BOTTOM

Supply Voltage :

3.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Functions :

1