IS61NLP102418-200B3I

Manufacturer :

Integrated Silicon Solution, Inc. (ISSI)

Product Category :

Memory

Standby Current-Max :

0.075A

Width :

13mm

Supply Voltage-Min (Vsup) :

3.135V

Packaging :

Tray

Supply Voltage-Max (Vsup) :

3.465V

Output Characteristics :

3-STATE

Qualification Status :

Not Qualified

Pin Count :

165

RoHS Status :

ROHS3 Compliant

JESD-609 Code :

e0

Memory Interface :

Parallel

Number of Pins :

165

Memory Type :

Volatile

Package / Case :

165-TBGA

Number of Functions :

1

Terminal Finish :

Tin/Lead (Sn/Pb)

Surface Mount :

yes

Supply Current-Max :

0.475mA

Memory Width :

18

Terminal Pitch :

1mm

Operating Temperature :

-40°C~85°C TA

Memory Size :

18Mb 1M x 18

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

HTS Code :

8542.32.00.41

Organization :

1MX18

Memory Density :

18874368 bit

Standby Voltage-Min :

3.14V

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

ECCN Code :

3A991.B.2.A

I/O Type :

COMMON

Supply Voltage :

3.3V

Additional Feature :

PIPELINED ARCHITECTURE

Power Supplies :

2.5/3.33.3V

Voltage - Supply :

3.135V~3.465V

Pbfree Code :

No

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Memory Format :

SRAM

Length :

15mm

Access Time :

3.1ns

Number of Terminations :

165

Clock Frequency :

200MHz

Height Seated (Max) :

1.2mm