IS61LPS51236B-200B3LI
- Mfr.Part #
- IS61LPS51236B-200B3LI
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 3,147
- In Stock :
- 3,147
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Surface Mount :
- yes
- Memory Size :
- 18Mb 512K x 36
- Voltage - Supply :
- 3.135V~3.465V
- Height Seated (Max) :
- 1.2mm
- Memory Type :
- Volatile
- Number of Terminations :
- 165
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Memory Format :
- SRAM
- Length :
- 15mm
- Width :
- 13mm
- Supply Voltage :
- 3.3V
- Number of Pins :
- 165
- Memory Interface :
- Parallel
- Memory Width :
- 36
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 12 Weeks
- Terminal Pitch :
- 1mm
- Access Time :
- 3ns
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tray
- Memory Density :
- 18874368 bit
- Supply Voltage-Max (Vsup) :
- 3.465V
- Number of Functions :
- 1
- Operating Temperature :
- -40°C~85°C TA
- Supply Voltage-Min (Vsup) :
- 3.135V
- Package / Case :
- 165-TBGA
- Clock Frequency :
- 200MHz
- Organization :
- 512KX36
- Terminal Position :
- BOTTOM
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- IS61LPS51236B-200B3LI
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236B-200B3LI Overview
Discover unparalleled efficiency and reliability with the IS61LPS51236B-200B3LI from Integrated Silicon Solution, Inc. (ISSI). This cutting-edge IC SRAM 18MBIT PARALLEL, housed in a robust 165TFBGA package, epitomizes technological advancement in memory solutions. Designed to meet the demanding requirements of modern electronic systems, this device ensures lightning-fast data access and seamless operation, making it an indispensable component for a wide range of applications.
IS61LPS51236B-200B3LI Features
- High capacity: With a massive 18MBIT storage capacity, the IS61LPS51236B-200B3LI provides ample space for storing critical data, ensuring optimal performance in memory-intensive applications.
- Parallel interface: The parallel interface enables rapid data transfer, facilitating swift communication between the memory and the host system, thereby enhancing overall system efficiency.
- Compact form factor: Housed in a space-saving 165TFBGA package, this IC offers high density without compromising on reliability, making it ideal for compact electronic devices where space is at a premium.
- Low power consumption: The IS61LPS51236B-200B3LI is designed for energy efficiency, consuming minimal power during operation, which extends battery life and reduces overall power consumption in portable devices.
- Robust design: Built to withstand harsh operating conditions, this IC is engineered for durability and reliability, ensuring consistent performance even in demanding environments.
IS61LPS51236B-200B3LI Applications
- Data storage systems: The high capacity and fast data access of the IS61LPS51236B-200B3LI make it an ideal choice for data storage systems, including servers, network appliances, and RAID controllers. Its reliability ensures uninterrupted data access and seamless operation in mission-critical environments.
- Embedded systems: With its compact form factor and low power consumption, the IS61LPS51236B-200B3LI is well-suited for embedded systems such as industrial automation equipment, medical devices, and automotive electronics. Its high density and robust design enable efficient performance in space-constrained and harsh operating environments.
- Telecommunications equipment: The parallel interface and high-speed data transfer capability of the IS61LPS51236B-200B3LI make it a perfect fit for telecommunications equipment, including routers, switches, and base stations. Its reliability ensures seamless communication and uninterrupted operation in telecommunications networks.
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