IS61LPS51236A-200B3LI

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Mfr.Part #
IS61LPS51236A-200B3LI
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
14,667
In Stock :
14,667

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Peak Reflow Temperature (Cel) :
260
Nominal Supply Current :
475mA
Output Characteristics :
3-STATE
Terminal Pitch :
1mm
Pbfree Code :
yes
Number of Terminations :
165
Density :
18 Mb
I/O Type :
COMMON
Additional Feature :
PIPELINED ARCHITECTURE
Operating Temperature :
-40°C~85°C TA
Number of Ports :
4
Memory Interface :
Parallel
Supply Voltage-Min (Vsup) :
3.135V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Clock Frequency :
200MHz
Voltage - Supply :
3.135V~3.465V
Pin Count :
165
Mounting Type :
Surface Mount
Radiation Hardening :
No
Sync/Async :
SYNCHRONOUS
ECCN Code :
3A991.B.2.A
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Operating Supply Voltage :
3.3V
Access Time :
3.1ns
Time@Peak Reflow Temperature-Max (s) :
40
Organization :
512KX36
Memory Type :
Volatile
RoHS Status :
RoHS Compliant
Word Size :
36b
Memory Format :
SRAM
Package / Case :
165-TBGA
Supply Voltage :
3.3V
Address Bus Width :
19b
Terminal Position :
BOTTOM
Length :
15mm
JESD-609 Code :
e1
Number of Pins :
165
Memory Width :
36
Height Seated (Max) :
1.2mm
Mount :
Surface Mount
Memory Size :
18Mb 512K x 36
Standby Current-Max :
0.125A
Number of Functions :
1
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3LI from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Package / Case:165-TBGA, Number of Pins:165, IS61LPS51236A-200B3LI pinout, IS61LPS51236A-200B3LI datasheet PDF, IS61LPS51236A-200B3LI amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3LI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3LI


Memory Integrated Silicon Solution, Inc. (ISSI) IS61LPS51236A-200B3LI Overview

Introducing the cutting-edge IC SRAM 18MBIT PARALLEL 165TFBGA, manufactured by Integrated Silicon Solution, Inc. (ISSI). This innovative product stands at the forefront of memory technology, offering unparalleled performance and reliability for a wide range of applications.

Designed with precision and expertise, this SRAM module boasts a massive 18MBIT capacity, ensuring ample storage for your critical data. Its parallel architecture enables lightning-fast data access, making it ideal for high-performance computing and industrial applications.

Whether you're designing advanced electronics for aerospace, telecommunications, or automotive industries, the IS61LPS51236A-200B3LI sets the standard for excellence in memory solutions. Trust ISSI to deliver the quality and reliability you need to power your next-generation devices.

IS61LPS51236A-200B3LI Features

  • High Capacity: With an impressive 18MBIT storage capacity, this SRAM module provides ample space for storing critical data.
  • Parallel Architecture: The parallel architecture ensures lightning-fast data access, making it ideal for high-performance computing applications.
  • Compact Design: Housed in a 165TFBGA package, this SRAM module offers a compact footprint, saving valuable board space in your designs.
  • Reliability: Manufactured by Integrated Silicon Solution, Inc. (ISSI), this SRAM module is built to the highest quality standards, ensuring long-term reliability in demanding environments.

IS61LPS51236A-200B3LI Applications

  • Industrial Automation: Deploy the IS61LPS51236A-200B3LI in industrial control systems, where its high capacity and fast access times ensure efficient data processing and control.
  • Telecommunications Infrastructure: Power your telecommunications infrastructure with the IS61LPS51236A-200B3LI, delivering the performance and reliability required for seamless communication networks.
  • Embedded Systems: Incorporate the IS61LPS51236A-200B3LI into embedded systems for automotive applications, enabling advanced features and functionality in vehicles.
  • Aerospace Electronics: Ensure mission-critical reliability in aerospace electronics with the IS61LPS51236A-200B3LI, providing the storage capacity and speed necessary for onboard data processing.
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Shipping Cost

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