HTSW-138-22-G-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Style :

Board to Board or Cable

Published :

2005

Mating Contact Pitch :

0.1 inch

Series :

HTSW

Termination :

Solder

Current Rating (Amps) :

Varies by WireGAuge

Pitch - Mating :

0.100 2.54mm

Row Spacing - Mating :

0.100 (2.54mm)

Contact Type :

Male Pin

Packaging :

Bulk

Gender :

Male

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Contact Shape :

Square

Reliability :

COMMERCIAL

Number of Positions :

76

Lead Pitch :

2.54mm

HTS Code :

8536.69.40.40

Radiation Hardening :

No

Moisture Sensitivity Level (MSL) :

Not Applicable

JESD-609 Code :

e4

Pbfree Code :

yes

Contact Finish - Mating :

Gold

Contact Material :

Phosphor Bronze

Number of Positions Loaded :

All

Shrouding :

Unshrouded

Filter Feature :

No

Overall Contact Length :

0.630 16.00mm

Contact Length - Mating :

0.230 5.84mm

MIL Conformance :

No

Number of Rows :

2

Mount :

Through Hole

Mixed Contacts :

No

Additional Feature :

E.L.P.

Mating Information :

MULTIPLE MATING PARTS AVAILABLE

DIN Conformance :

No

Material Flammability Rating :

UL94 V-0

Mounting Type :

Through Hole

Fastening Type :

Push-Pull

Body Length or Diameter :

3.8 inch

Contact Finish Thickness - Post :

3.00μin 0.076μm

ECCN Code :

EAR99

Number Of PCB Rows :

2

Number of Conductors :

ONE

Factory Lead Time :

3 Weeks

Body Depth :

0.1 inch

Connector Type :

Header

IEC Conformance :

No

Contact Length - Post :

0.300 7.62mm

Insulation Color :

Natural

Operating Temperature :

-55°C~125°C

Insulation Height :

0.100 2.54mm

RoHS Status :

ROHS3 Compliant

Body Breadth :

0.198 inch

Option :

GENERAL PURPOSE

PCB Contact Pattern :

RECTANGULAR

REACH SVHC :

No SVHC

Insulation Material :

Liquid Crystal Polymer (LCP)