HTSW-136-08-G-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Row Spacing - Mating :

0.100 (2.54mm)

Insulation Color :

Natural

Packaging :

Bulk

Mating Contact Pitch :

0.1 inch

Number of Positions :

72

Shrouding :

Unshrouded

Number of Rows :

2

Mounting Type :

Through Hole

Number of Positions Loaded :

All

MIL Conformance :

No

Number Of PCB Rows :

2

Body Length or Diameter :

3.6 inch

Contact Finish - Mating :

Gold

Connector Type :

Header

Pitch - Mating :

0.100 2.54mm

Lead Pitch :

2.54mm

Body Breadth :

0.198 inch

JESD-609 Code :

e4

Published :

2005

Mating Information :

MULTIPLE MATING PARTS AVAILABLE

Current Rating (Amps) :

Varies by WireGAuge

Moisture Sensitivity Level (MSL) :

Not Applicable

Body Depth :

0.1 inch

Filter Feature :

No

Additional Feature :

E.L.P.

Style :

Board to Board or Cable

DIN Conformance :

No

PCB Contact Pattern :

RECTANGULAR

Contact Finish Thickness - Post :

3.00μin 0.076μm

Material Flammability Rating :

UL94 V-0

Insulation Height :

0.100 2.54mm

Radiation Hardening :

No

Contact Length - Post :

0.200 5.08mm

Number of Conductors :

ONE

Mixed Contacts :

No

Insulation Material :

Liquid Crystal Polymer (LCP)

Mount :

Through Hole

Option :

GENERAL PURPOSE

Series :

HTSW

Fastening Type :

Push-Pull

Contact Shape :

Square

Contact Length - Mating :

0.230 5.84mm

IEC Conformance :

No

Gender :

Male

Contact Type :

Male Pin

Operating Temperature :

-55°C~125°C

Termination :

Solder

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Factory Lead Time :

3 Weeks

Overall Contact Length :

0.530 13.46mm

Pbfree Code :

yes

Reliability :

COMMERCIAL

RoHS Status :

ROHS3 Compliant

REACH SVHC :

No SVHC

Contact Material :

Phosphor Bronze