HTSW-135-23-G-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Fastening Type :

Push-Pull

Overall Contact Length :

0.445 11.30mm

Number Of PCB Rows :

2

Operating Temperature :

-55°C~125°C

Packaging :

Bulk

Mounting Type :

Through Hole

Mating Information :

MULTIPLE MATING PARTS AVAILABLE

Published :

2005

Pitch - Mating :

0.100 2.54mm

Mating Contact Pitch :

0.1 inch

Mount :

Through Hole

Reliability :

COMMERCIAL

Contact Finish Thickness - Mating :

10.0μin 0.25μm

REACH SVHC :

No SVHC

Contact Length - Post :

0.115 2.92mm

Radiation Hardening :

No

Filter Feature :

No

Body Depth :

0.1 inch

PCB Contact Pattern :

RECTANGULAR

Insulation Color :

Natural

Number of Positions :

70

Additional Feature :

E.L.P.

JESD-609 Code :

e4

Factory Lead Time :

3 Weeks

Shrouding :

Unshrouded

IEC Conformance :

No

Series :

HTSW

Body Breadth :

0.198 inch

Number of Conductors :

ONE

Number of Positions Loaded :

All

Insulation Height :

0.100 2.54mm

Moisture Sensitivity Level (MSL) :

Not Applicable

MIL Conformance :

No

Pbfree Code :

yes

Body Length or Diameter :

3.5 inch

Gender :

Male

Contact Length - Mating :

0.230 5.84mm

Termination :

Solder

Material Flammability Rating :

UL94 V-0

DIN Conformance :

No

Lead Pitch :

2.54mm

Contact Shape :

Square

Option :

GENERAL PURPOSE

Connector Type :

Header

Mixed Contacts :

No

Insulation Material :

Liquid Crystal Polymer (LCP)

Contact Finish - Mating :

Gold

Contact Material :

Phosphor Bronze

Style :

Board to Board or Cable

Row Spacing - Mating :

0.100 (2.54mm)

Contact Type :

Male Pin

Current Rating (Amps) :

Varies by WireGAuge

Number of Rows :

2

RoHS Status :

ROHS3 Compliant

Contact Finish Thickness - Post :

3.00μin 0.076μm