HTSW-130-23-S-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

JESD-609 Code :

e3

Contact Finish Thickness - Mating :

30.0μin 0.76μm

Termination :

Solder

Body Length or Diameter :

3 inch

Shrouding :

Unshrouded

Material Flammability Rating :

UL94 V-0

Operating Temperature :

-55°C~125°C

Contact Length - Post :

0.115 2.92mm

Contact Length - Mating :

0.230 5.84mm

Factory Lead Time :

3 Weeks

Row Spacing - Mating :

0.100 (2.54mm)

Style :

Board to Board or Cable

Contact Type :

Male Pin

Contact Shape :

Square

Insulation Height :

0.100 2.54mm

Published :

2016

Reliability :

COMMERCIAL

Contact Material :

Phosphor Bronze

Option :

GENERAL PURPOSE

Fastening Type :

Push-Pull

Insulation Material :

Liquid Crystal Polymer (LCP)

Number of Rows :

2

Additional Feature :

E.L.P.

Connector Type :

Header

Moisture Sensitivity Level (MSL) :

Not Applicable

Number of Positions :

60

Body Depth :

0.1 inch

Contact Finish - Mating :

Gold

Filter Feature :

No

Current Rating (Amps) :

Varies by WireGAuge

Pbfree Code :

yes

Overall Contact Length :

0.445 11.30mm

Mount :

Through Hole

Mating Contact Pitch :

0.1 inch

Contact Finish - Post :

Tin

Series :

HTSW

PCB Contact Pattern :

RECTANGULAR

Mixed Contacts :

No

Gender :

Male

RoHS Status :

ROHS3 Compliant

Body Breadth :

0.198 inch

Number Of PCB Rows :

2

Insulation Color :

Natural

Pitch - Mating :

0.100 2.54mm

Mounting Type :

Through Hole

IEC Conformance :

No

Number of Positions Loaded :

All

DIN Conformance :

No

MIL Conformance :

No

Number of Conductors :

ONE

Packaging :

Bulk