HTSW-113-11-G-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Factory Lead Time :

3 Weeks

Insulation Color :

Natural

Mating Contact Pitch :

0.1 inch

Series :

HTSW

IEC Conformance :

No

Termination :

Solder

Pitch - Mating :

0.100 2.54mm

Mixed Contacts :

No

Contact Shape :

Square

Body Depth :

0.1 inch

Fastening Type :

Push-Pull

Number Of PCB Rows :

2

Number of Positions :

26

Mounting Type :

Through Hole

Contact Type :

Male Pin

DIN Conformance :

No

Insulation Height :

0.100 2.54mm

Published :

2005

Body Breadth :

0.198 inch

Lead Pitch :

2.54mm

Filter Feature :

No

Material Flammability Rating :

UL94 V-0

RoHS Status :

ROHS3 Compliant

Reliability :

COMMERCIAL

Style :

Board to Board or Cable

Contact Finish Thickness - Post :

3.00μin 0.076μm

Gender :

Male

Mount :

Through Hole

Number of Conductors :

ONE

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Option :

GENERAL PURPOSE

Body Length or Diameter :

1.3 inch

PCB Contact Pattern :

RECTANGULAR

Pbfree Code :

yes

Row Spacing - Mating :

0.100 (2.54mm)

Mating Information :

MULTIPLE MATING PARTS AVAILABLE

Insulation Material :

Liquid Crystal Polymer (LCP)

MIL Conformance :

No

Connector Type :

Header

UL Flammability Code :

94V-0

REACH SVHC :

No SVHC

Moisture Sensitivity Level (MSL) :

Not Applicable

Additional Feature :

E.L.P.

Current Rating (Amps) :

Varies by WireGAuge

Shrouding :

Unshrouded

Number of Rows :

2

Overall Contact Length :

0.930 23.62mm

Contact Length - Mating :

0.230 5.84mm

Contact Material :

Phosphor Bronze

Number of Positions Loaded :

All

Packaging :

Bulk

JESD-609 Code :

e4

Contact Finish - Mating :

Gold

Contact Length - Post :

0.600 15.24mm

Operating Temperature :

-55°C~125°C