HTSW-112-23-G-D

Manufacturer :

Samtec, Inc.

Product Category :

Headers, Male Pins

Termination :

Solder

Insulation Material :

Liquid Crystal Polymer (LCP)

Mating Contact Pitch :

0.1 inch

Fastening Type :

Push-Pull

Contact Finish - Mating :

Gold

Contact Length - Mating :

0.230 5.84mm

Current Rating (Amps) :

Varies by WireGAuge

Additional Feature :

E.L.P.

Body Depth :

0.1 inch

Mating Information :

MULTIPLE MATING PARTS AVAILABLE

Contact Finish Thickness - Post :

3.00μin 0.076μm

Overall Contact Length :

0.445 11.30mm

Body Breadth :

0.198 inch

RoHS Status :

ROHS3 Compliant

ECCN Code :

EAR99

Number of Positions :

24

Pitch - Mating :

0.100 2.54mm

Contact Finish Thickness - Mating :

10.0μin 0.25μm

Pbfree Code :

yes

Factory Lead Time :

3 Weeks

Number of Rows :

2

Row Spacing - Mating :

0.100 (2.54mm)

JESD-609 Code :

e4

Connector Type :

Header

Number of Positions Loaded :

All

Contact Length - Post :

0.115 2.92mm

Lead Pitch :

2.54mm

Reliability :

COMMERCIAL

Contact Type :

Male Pin

REACH SVHC :

No SVHC

Packaging :

Bulk

Material Flammability Rating :

UL94 V-0

Number of Conductors :

ONE

Mixed Contacts :

No

Published :

2005

Moisture Sensitivity Level (MSL) :

Not Applicable

Mount :

Through Hole

IEC Conformance :

No

Gender :

Male

DIN Conformance :

No

Insulation Height :

0.100 2.54mm

Contact Shape :

Square

Shrouding :

Unshrouded

Mounting Type :

Through Hole

Series :

HTSW

Style :

Board to Board or Cable

Filter Feature :

No

Number Of PCB Rows :

2

Insulation Color :

Natural

HTS Code :

8536.69.40.40

PCB Contact Pattern :

RECTANGULAR

Operating Temperature :

-55°C~125°C

Option :

GENERAL PURPOSE

MIL Conformance :

No

Contact Material :

Phosphor Bronze