HTSS-107-03-S-DV
- Mfr.Part #
- HTSS-107-03-S-DV
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 14POS 2.54MM
- Stock
- 42,713
- In Stock :
- 42,713
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Contact Finish - Post :
- Tin
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- RoHS Status :
- ROHS3 Compliant
- Insulation Height :
- 0.350 8.89mm
- Shrouding :
- Shrouded - 4 Wall
- Pitch - Mating :
- 0.100 2.54mm
- Fastening Type :
- Push-Pull
- Contact Length - Mating :
- 0.250 6.35mm
- Operating Temperature :
- -55°C~125°C
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Termination :
- Solder
- Number of Positions :
- 14
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Insulation Color :
- Natural
- Contact Type :
- Male Pin
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Factory Lead Time :
- 3 Weeks
- Contact Material :
- Phosphor Bronze
- Gender :
- Male
- Packaging :
- Bulk
- Feature :
- Keying Slot
- Material Flammability Rating :
- UL94 V-0
- Mounting Type :
- Surface Mount
- Connector Type :
- Header
- Contact Finish - Mating :
- Gold
- Number of Positions Loaded :
- All
- Contact Shape :
- Square
- Style :
- Board to Board or Cable
- Radiation Hardening :
- No
- Number of Rows :
- 2
- Series :
- Flex Stack, HTSS
- Datasheets
- HTSS-107-03-S-DV
Flex Stack, HTSS Series 2-Row Header Solder Phosphor Bronze Bulk Surface Mount Gold Liquid Crystal Polymer (LCP) 14-Position Board to Board or Cable 0.350 8.89mm Height
HTSS-107-03-S-DV Overview
Packaging is Header.Surface Mount is the mounting type.Packaging for the product is carried out via a Bulk case.As a product of the Flex Stack, HTSS Series, it can be found in this category.With its Keying Slot feature, it is more powerful in many ways.The device is operating at -55°C~125°C Operating Temperature.
HTSS-107-03-S-DV Features
Flex Stack, HTSS series
HTSS-107-03-S-DV Applications
There are a lot of Samtec Inc.
HTSS-107-03-S-DV Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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