HNC2-2.5P-2DS(01)
- Mfr.Part #
- HNC2-2.5P-2DS(01)
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 2POS 2.5MM
- Stock
- 5,238
- In Stock :
- 5,238
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- Manufacturer :
- Hirose
- Product Category :
- Headers, Male Pins
- Insulation Color :
- Black
- RoHS Status :
- RoHS Compliant
- Stack Height (Mating) :
- 15.5mm
- Insulation Material :
- Polyamide (PA), Nylon
- Voltage - Rated :
- 250V
- Contact Type :
- Male Pin
- Termination :
- Solder
- Style :
- Board to Board or Cable
- Reach Compliance Code :
- Unknown
- Contact Length - Mating :
- 0.197 5.00mm
- Fastening Type :
- Push-Pull
- Factory Lead Time :
- 10 Weeks
- ECCN Code :
- EAR99
- Insulation Height :
- 0.256 6.50mm
- HTS Code :
- 8536.69.40.40
- Material Flammability Rating :
- UL94 V-0
- Pitch - Mating :
- 0.098 2.50mm
- Contact Shape :
- Square
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Rows :
- 1
- Shrouding :
- Unshrouded
- Series :
- HNC
- Contact Length - Post :
- 0.118 3.00mm
- Operating Temperature :
- -55°C~85°C
- Connector Type :
- Header
- Contact Finish - Mating :
- Gold
- Lead Free :
- Lead Free
- Mount :
- Through Hole
- Contact Material :
- Brass
- Number of Positions :
- 2
- Overall Contact Length :
- 0.433 11.00mm
- Mounting Type :
- Through Hole
- Contact Finish Thickness - Mating :
- 12.0μin 0.30μm
- Packaging :
- Bulk
- Number of Positions Loaded :
- All
- Datasheets
- HNC2-2.5P-2DS(01)
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HNC Series 1-Row Header Solder Brass Bulk Through Hole Gold Polyamide (PA), Nylon 2-Position Board to Board or Cable 0.256 6.50mm Height
HNC2-2.5P-2DS(01) Overview
This product is packaged in a Header box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the HNC Series.By Through Hole, the part is mounted.Operating temperature is set to -55°C~85°C.
HNC2-2.5P-2DS(01) Features
HNC series
HNC2-2.5P-2DS(01) Applications
There are a lot of Hirose Electric Co Ltd
HNC2-2.5P-2DS(01) Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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