HMTSW-127-11-S-T-740

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Mfr.Part #
HMTSW-127-11-S-T-740
Manufacturer
Samtec, Inc.
Package / Case
Datasheet
Download
Description
CONN HEADER VERT 81POS 2.54MM
Stock
6,654
In Stock :
6,654

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Manufacturer :
Samtec, Inc.
Product Category :
Headers, Male Pins
Number of Positions Loaded :
All
Contact Finish - Mating :
Gold
Factory Lead Time :
3 Weeks
Contact Shape :
Square
Operating Temperature :
-55°C~125°C
Number of Positions :
81
Series :
Flex Stack, HMTSW
Contact Length - Mating :
0.740 18.80mm
Radiation Hardening :
No
Contact Type :
Male Pin
Current Rating (Amps) :
3A
DIN Conformance :
No
Contact Material :
Phosphor Bronze
Mount :
Through Hole
Packaging :
Bulk
Filter Feature :
No
Material Flammability Rating :
UL94 V-0
Gender :
Male
MIL Conformance :
No
Connector Type :
Header
Row Spacing - Mating :
0.100 (2.54mm)
Overall Contact Length :
0.930 23.62mm
Insulation Height :
0.100 2.54mm
Pitch - Mating :
0.100 2.54mm
Moisture Sensitivity Level (MSL) :
Not Applicable
Contact Finish Thickness - Mating :
30.0μin 0.76μm
JESD-609 Code :
e3
Mixed Contacts :
No
Insulation Color :
Natural
RoHS Status :
ROHS3 Compliant
Shrouding :
Unshrouded
Terminal Pitch :
2.54mm
Pbfree Code :
yes
Contact Finish - Post :
Tin
Insulation Material :
Liquid Crystal Polymer (LCP)
Contact Length - Post :
0.090 2.29mm
IEC Conformance :
No
Mounting Type :
Through Hole
Number of Rows :
3
Termination :
Solder
Fastening Type :
Push-Pull
Style :
Board to Board or Cable
Option :
GENERAL PURPOSE
Introducing Headers, Male Pins Samtec, Inc. HMTSW-127-11-S-T-740 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-55°C~125°C, Mounting Type:Through Hole, HMTSW-127-11-S-T-740 pinout, HMTSW-127-11-S-T-740 datasheet PDF, HMTSW-127-11-S-T-740 amp .Beyond Headers, Male Pins Samtec, Inc. HMTSW-127-11-S-T-740 ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.



Flex Stack, HMTSW Series 3-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 81-Position Board to Board or Cable 0.100 2.54mm Height

HMTSW-127-11-S-T-740 Overview


This product is packaged in a Header box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the Flex Stack, HMTSW Series.By Through Hole, the part is mounted.Operating temperature is set to -55°C~125°C.

HMTSW-127-11-S-T-740 Features


Flex Stack, HMTSW series


HMTSW-127-11-S-T-740 Applications


There are a lot of Samtec Inc.
HMTSW-127-11-S-T-740 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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