HD6417750RF240V
- Mfr.Part #
- HD6417750RF240V
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 208-BFQFP Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 32BIT ROMLESS 208HQFP
- Stock
- 1,446
- In Stock :
- 1,446
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Microcontrollers
- Brand Name :
- Renesas
- Pin Count :
- 208
- Qualification Status :
- Not Qualified
- Format :
- Floating Point
- Terminal Form :
- Gull wing
- Terminal Position :
- QUAD
- Package Shape :
- Square
- Connectivity :
- EBI/EMI, FIFO, SCI, SmartCard
- Number of I/O :
- 28
- Temperature Grade :
- COMMERCIAL EXTENDED
- Technology :
- CMOS
- Package :
- Tray
- JESD-609 Code :
- e6
- EEPROM Size :
- -
- ECCN Code :
- 3A991.A.2
- Reach Compliance Code :
- Compliant
- Program Memory Size :
- -
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR, RISC
- Base Product Number :
- HD6417750
- Integrated Cache :
- yes
- Data Converters :
- -
- Oscillator Type :
- External
- Bit Size :
- 32
- Series :
- SuperH® SH7750
- Supplier Device Package :
- 208-HQFP (28x28)
- Boundary Scan :
- yes
- Low Power Mode :
- yes
- Mounting Type :
- Surface Mount
- Program Memory Type :
- ROMless
- Terminal Finish :
- Tin/Bismuth (Sn/Bi)
- Peripherals :
- DMA, POR, WDT
- Number of Terminals :
- 208
- Manufacturer :
- Renesas Electronics Corporation
- Peak Reflow Temperature (Cel) :
- 240
- Width :
- 28 mm
- Seated Height-Max :
- 3.56 mm
- Terminal Pitch :
- 0.5 mm
- Voltage - Supply (Vcc/Vdd) :
- 1.4V ~ 1.6V
- Operating Temperature :
- -20°C ~ 75°C (TA)
- Core Processor :
- SH-4
- Length :
- 28 mm
- JESD-30 Code :
- S-PQFP-G208
- Package / Case :
- 208-BFQFP Exposed Pad
- RAM Size :
- 48K x 8
- Speed :
- 240MHz
- Address Bus Width :
- 26
- Surface Mount :
- yes
- Core Size :
- 32-Bit Single-Core
- External Data Bus Width :
- 64
- HTS Code :
- 8542.31.00.01
- Product Status :
- Obsolete
- Datasheets
- HD6417750RF240V

Microcontrollers Intersil (Renesas Electronics Corporation) HD6417750RF240V Overview
The Microcontrollers Intersil (Renesas Electronics Corporation) HD6417750RF240V is a sophisticated, high-performance 32-bit MCU designed for advanced embedded applications. This ROMless microcontroller, housed in a 208HQFP package, is highly customizable, allowing developers to tailor the device to their specific application needs. Its ability to operate without internal ROM gives engineers the flexibility to choose external storage that best fits the application's requirements. This feature makes it particularly suitable for industries requiring high-speed processing and varied memory configurations, enhancing both system design flexibility and performance scalability.
HD6417750RF240V Features
This microcontroller stands out with its robust feature set, including a 32-bit processing core which offers exceptional computational speed and efficiency for handling complex algorithms and multi-task operations. The ROMless configuration of the HD6417750RF240V provides designers with the freedom to implement bespoke memory solutions, thereby optimizing system performance and cost. Additionally, the 208HQFP package ensures a compact footprint while allowing for sufficient I/O capabilities that are crucial for comprehensive system integration.
HD6417750RF240V Applications
- Industrial Automation: Integrates seamlessly into control systems, providing the processing power needed for real-time automation and monitoring, enhancing operational efficiency and reliability.
- Automotive Systems: Suitable for use in vehicle control systems, where its high-speed processing capabilities can handle complex tasks such as engine management and in-car entertainment systems.
- Medical Devices: Used in medical monitoring systems, where precision and reliability are paramount, the HD6417750RF240V delivers the necessary computation for critical medical applications.
- Consumer Electronics: Drives sophisticated consumer electronics, including gaming consoles and home automation systems, offering a flexible and powerful platform for user interfaces and connectivity.
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