HD6417144F50V

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Mfr.Part #
HD6417144F50V
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
112-BQFP
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 112QFP
Stock
11,347
In Stock :
11,347

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Peripherals :
DMA, POR, PWM, WDT
Data Converter :
A/D 8x10b
Number of Pins :
112
Factory Lead Time :
16 Weeks
Radiation Hardening :
No
Operating Temperature :
-20°C~75°C TA
Frequency :
40MHz
Operating Supply Voltage :
3.3V
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
Core Processor :
SH-2
RAM Size :
8K x 8
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Program Memory Type :
ROMless
Data Bus Width :
32b
Connectivity :
EBI/EMI, I2C, SCI
Number of Timers/Counters :
3
Packaging :
Tray
Interface :
EBI/EMI, I2C, SCI
Package / Case :
112-BQFP
Series :
SuperH® SH7144
Access Time :
50 µs
Base Part Number :
HD6417144
Core Size :
32-Bit
Mounting Type :
Surface Mount
Mount :
Surface Mount
Lead Free :
Lead Free
Number of UART Channels :
4
Oscillator Type :
Internal
Published :
2008
Number of I/O :
74
Datasheets
HD6417144F50V
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) HD6417144F50V from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:112, Operating Temperature:-20°C~75°C TA, Package / Case:112-BQFP, Base Part Number:HD6417144, Mounting Type:Surface Mount, HD6417144F50V pinout, HD6417144F50V datasheet PDF, HD6417144F50V amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) HD6417144F50V ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) HD6417144F50V


Microcontrollers Intersil (Renesas Electronics Corporation) HD6417144F50V Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) HD6417144F50V is a highly capable 32-bit MCU designed for advanced electronic applications requiring robust performance without an internal ROM. This ROMless configuration offers flexibility, allowing developers to customize memory according to specific application needs. Engineered for high reliability and efficiency, this microcontroller is housed in a 112-pin QFP package, providing a compact footprint while still supporting extensive I/O operations and connectivity. Its versatility makes it ideal for integrating into complex, multi-functional devices where space and power efficiency are critical.

HD6417144F50V Features

The HD6417144F50V from Intersil (Renesas Electronics Corporation) boasts several features that enhance its usability in various high-demand applications. Key features include a 32-bit processing core, a ROMless architecture for greater memory flexibility, and a compact 112QFP package that supports a wide range of I/O options and connectivity solutions. Additionally, its low-power consumption and high-speed processing capabilities make it an excellent choice for developing energy-efficient and high-performance applications.

HD6417144F50V Applications

  • Industrial Automation: In industrial automation, the HD6417144F50V can manage complex processes with its high-speed computation and versatile I/O configuration, ensuring seamless integration in PLC systems and motor control units.
  • Automotive Systems: This microcontroller can be employed in automotive applications, handling tasks such as engine management, infotainment systems, and advanced driver-assistance systems (ADAS) where reliability and performance are paramount.
  • Consumer Electronics: The HD6417144F50V is well-suited for consumer electronics, such as gaming consoles and smart home devices, offering the necessary processing power and connectivity options to support sophisticated user interfaces and connectivity.
  • Communication Infrastructure: Its capability to support multiple communication protocols makes it ideal for telecommunications equipment, including routers and network switches, enhancing data processing capabilities and connectivity.
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