H8261RBZA

Manufacturer :

TE Connectivity AMP Connectors

Product Category :

Through Hole Resistors

Working Voltage :

350 V

Composition :

Metal Film

Maximum Operating Temperature :

+ 155 C

Termination Style :

Axial

Resistance :

261 Ohms

Product Category :

Metal Film Resistors - Through Hole

Type :

FPGA + MCU/MPU SoC

Resistor Type :

FIXED RESISTOR

Temperature Coefficient :

±100ppm/°C

Size / Dimension :

0.098 Dia x 0.283 L (2.50mm x 7.20mm)

Minimum Operating Temperature :

- 55 C

Brand :

TE Connectivity / Holsworthy

Suggested Programming Environment :

Vivado

Platform :

Zynq UltraScale+ MPSoC ZCU102 ES2

Lead Length :

30 mm

Package :

Bulk

Number of Terminations :

2

Product Type :

Metal Film Resistors

Failure Rate :

--

Package / Case :

Axial

Rated Power Dissipation (P) :

0.25 W

Technology :

Metal Film

Power Rating :

250 mW (1/4 W)

Diameter :

2.5 mm

Packing Method :

Tape

Terminal Shape :

Wire

Base Product Number :

XCZU9

Interconnect System :

FMC, Pmod

Package Shape :

TUBULAR PACKAGE

Mounting Feature :

THROUGH HOLE MOUNT

Additional Feature :

PRECISION

Package Length :

7.2 mm

Lead Diameter :

0.6 mm

Contents :

Board(s), Cable(s), Power Supply, Accessories

ECCN Code :

EAR99

Mounting Style :

PCB Mount

Features :

Pulse Withstanding

Surface Mount :

No

Manufacturer :

TE Connectivity

Packaging :

Bulk

Construction :

Tubular

Tolerance :

±0.1%

Supplier Device Package :

Axial

Power (Watts) :

0.25W, 1/4W

Note :

-

Number of Terminals :

2

For Use With/Related Products :

XCZU9EG

Length :

7.2 mm

Rated Temperature :

70 °C

Product Status :

Obsolete

Series :

Zynq® UltraScale+™

Operating Temperature :

-55°C ~ 155°C

Reach Compliance Code :

Compliant

Subcategory :

Resistors

Height - Seated (Max) :

--