FSBB30CH60D
- Mfr.Part #
- FSBB30CH60D
- Manufacturer
- onsemi
- Package / Case
- 27-PowerDIP Module (1.205, 30.60mm)
- Datasheet
- Download
- Description
- MODULE SPM 600V 30A SPMPA
- Stock
- 44,824
- In Stock :
- 44,824
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- Manufacturer :
- onsemi
- Product Category :
- Power Driver Modules
- Output Voltage :
- 600V
- Collector Emitter Voltage (VCEO) :
- 2.1V
- Power Supplies :
- 15V
- RoHS Status :
- ROHS3 Compliant
- Max Power Dissipation :
- 113W
- Configuration :
- 3 Phase Inverter
- ECCN Code :
- EAR99
- Number of Outputs :
- 3
- Terminal Finish :
- Tin (Sn)
- Supply Voltage-Max (Vsup) :
- 16.5V
- Length :
- 44mm
- Temperature Grade :
- Automotive
- Height Seated (Max) :
- 7.5mm
- Min Operating Temperature :
- -40°C
- Terminal Position :
- Dual
- Number of Functions :
- 1
- Series :
- Motion SPM® 3
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Published :
- 2014
- Lifecycle Status :
- ACTIVE, NOT REC (Last Updated: 2 days ago)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Frequency :
- 20kHz
- Number of Terminations :
- 27
- Operating Supply Current :
- 6mA
- JESD-609 Code :
- e3
- Max Current Rating :
- 30A
- Qualification Status :
- Not Qualified
- Mount :
- Through Hole
- Voltage - Isolation :
- 2500Vrms
- Supply Current-Max (Isup) :
- 10mA
- Supply Voltage-Min (Vsup) :
- 14V
- Operating Supply Voltage :
- 300V
- HTS Code :
- 8541.29.00.95
- Number of Pins :
- 27
- Weight :
- 21.978g
- Output Current :
- 30A
- Package / Case :
- 27-PowerDIP Module (1.205, 30.60mm)
- Max Operating Temperature :
- 150°C
- Type :
- IGBT
- Mounting Type :
- Through Hole
- Supply Voltage :
- 15V
- Pbfree Code :
- yes
- Datasheets
- FSBB30CH60D

FSBB30CH60D datasheet pdf and Power Driver Modules product details from ON Semiconductor stock available at
The ON Semiconductor FSBB30CH60D is a Power Driver Module (SPM) designed for use in high-power applications. It is a 600V, 30A SPMPAK module that provides a high-performance, cost-effective solution for driving power MOSFETs and IGBTs. The module features a low-profile, surface-mount package and is designed to provide superior thermal performance.
Features:
- 600V, 30A SPMPAK module
- Low-profile, surface-mount package
- High-performance, cost-effective solution
- Superior thermal performance
- Low EMI and ESD susceptibility
- High-speed switching capability
- Over-temperature protection
- Over-current protection
- Under-voltage lockout
Applications:
The ON Semiconductor FSBB30CH60D Power Driver Module is suitable for a wide range of applications, including motor control, power conversion, and power management. It is ideal for use in high-power applications such as solar inverters, UPS systems, and industrial automation.
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