EP2SGX30DF780I4

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Mfr.Part #
EP2SGX30DF780I4
Manufacturer
Altera (Intel)
Package / Case
780-BBGA
Datasheet
Download
Description
IC FPGA 361 I/O 780FBGA
Stock
18,321
In Stock :
18,321

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Supply Voltage :
1.2V
Number of LABs/CLBs :
1694
HTS Code :
8542.39.00.01
Terminal Form :
Ball
Height Seated (Max) :
3.5mm
Mounting Type :
Surface Mount
Number of Outputs :
361
Operating Temperature :
-40°C~100°C TJ
Qualification Status :
Not Qualified
Number of Terminations :
780
Terminal Pitch :
1mm
Package / Case :
780-BBGA
Time@Peak Reflow Temperature-Max (s) :
40
RoHS Status :
RoHS Compliant
Length :
29mm
Series :
Stratix® II GX
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e1
Voltage - Supply :
1.15V~1.25V
Peak Reflow Temperature (Cel) :
245
Clock Frequency :
717MHz
Number of I/O :
361
Surface Mount :
yes
Width :
29mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Total RAM Bits :
1369728
JESD-30 Code :
S-PBGA-B780
Base Part Number :
EP2SGX30
Power Supplies :
1.21.2/3.33.3V
Factory Lead Time :
8 Weeks
Terminal Position :
BOTTOM
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Combinatorial Delay of a CLB-Max :
5.117 ns
Number of Logic Elements/Cells :
33880
ECCN Code :
3A991
Number of Inputs :
361
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX30DF780I4 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Terminations:780, Package / Case:780-BBGA, Base Part Number:EP2SGX30, EP2SGX30DF780I4 pinout, EP2SGX30DF780I4 datasheet PDF, EP2SGX30DF780I4 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX30DF780I4 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2SGX30DF780I4


FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX30DF780I4 Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX30DF780I4 represents a pinnacle in FPGA technology, crafted by Altera (now part of Intel). This device is encapsulated in a 780FBGA package and boasts an impressive array of 361 I/O pins, making it highly adaptable for various demanding applications. Designed for efficiency and high-performance, the EP2SGX30DF780I4 offers a robust solution for developers looking to push the boundaries of customizable logic solutions. Its versatility in handling complex algorithms and processes makes it a prime choice for industries requiring high-speed data processing and real-time execution capabilities.

EP2SGX30DF780I4 Features

The EP2SGX30DF780I4 FPGA features a dense configuration of logic elements, enabling substantial data throughput and high-level processing capabilities in a compact form factor. With its integration into the Intel ecosystem, users benefit from enhanced support and compatibility with other Intel products, ensuring seamless implementation and operation. The 780-pin fine-pitch ball grid array (FBGA) package allows for a more efficient layout and better heat distribution, which is critical in high-performance environments.

EP2SGX30DF780I4 Applications

  • Telecommunications: Utilized in networking equipment, this FPGA manages high-speed signal processing tasks, facilitating enhanced data flow and connectivity.
  • Automotive: Critical in driver assistance systems, the EP2SGX30DF780I4 processes multiple real-time inputs to provide rapid response capabilities, ensuring higher safety standards.
  • Industrial Automation: In automated production lines, this FPGA orchestrates complex control systems, optimizing operational efficiency and reliability.
  • Consumer Electronics: Found in high-end consumer electronics, it supports sophisticated user interfaces and multitasking environments, enhancing user experience.
  • Medical Devices: Essential for diagnostic and imaging equipment, it ensures precise data handling and processing, critical for accurate diagnostics.
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