EP2S130F1508C3

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Mfr.Part #
EP2S130F1508C3
Manufacturer
Altera (Intel)
Package / Case
1508-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 1126 I/O 1508FBGA
Stock
1,453
In Stock :
1,453

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
132540
Surface Mount :
yes
Mounting Type :
Surface Mount
JESD-609 Code :
e1
Terminal Position :
BOTTOM
Series :
Stratix® II
Height Seated (Max) :
3.5mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
8 Weeks
Supply Voltage :
1.2V
Length :
40mm
Clock Frequency :
717MHz
HTS Code :
8542.39.00.01
Voltage - Supply :
1.15V~1.25V
ECCN Code :
3A001.A.7.A
Number of LABs/CLBs :
6627
Terminal Form :
Ball
JESD-30 Code :
S-PBGA-B1508
Number of I/O :
1126
Number of Outputs :
1118
Total RAM Bits :
6747840
Power Supplies :
1.21.5/3.33.3V
Width :
40mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~85°C TJ
Terminal Pitch :
1mm
Base Part Number :
EP2S130
Combinatorial Delay of a CLB-Max :
4.672 ns
Peak Reflow Temperature (Cel) :
245
Qualification Status :
Not Qualified
RoHS Status :
RoHS Compliant
Package / Case :
1508-BBGA, FCBGA
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Datasheets
EP2S130F1508C3
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2S130F1508C3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Base Part Number:EP2S130, Package / Case:1508-BBGA, FCBGA, EP2S130F1508C3 pinout, EP2S130F1508C3 datasheet PDF, EP2S130F1508C3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2S130F1508C3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2S130F1508C3


FPGAs Altera (Intel) EP2S130F1508C3 Overview

The FPGAs Altera (Intel) EP2S130F1508C3 is a high-performance integrated circuit designed by Intel, aimed at delivering optimal flexibility and efficiency. Its 1508-pin FBGA package houses a robust FPGA platform that supports a wide range of applications, from complex digital signal processing to high-speed data communication. This product stands out in the industry due to its extensive I/O capabilities, which include 1126 programmable I/O pins, making it an ideal choice for developers looking to harness the power of customizable logic for targeted system functionality. With Intel's reliable manufacturing, this FPGA ensures longevity and durability for large-scale deployments.

EP2S130F1508C3 Features

The EP2S130F1508C3 FPGA is equipped with several key features that make it highly valuable for extensive applications. These features include a large number of I/O pins, a high-density pin configuration, and advanced security protocols, ensuring safe and reliable operation in diverse environments. Its scalability and adaptability to multiple functionalities make it a go-to choice for engineers seeking a versatile and efficient solution for their hardware projects.

EP2S130F1508C3 Applications

  • Telecommunications Infrastructure: The FPGA can be utilized in routers and switches to manage data flow efficiently, ensuring robust and scalable network architectures.
  • Automotive Systems: Its capacity to handle complex algorithms quickly makes it suitable for advanced driver-assistance systems (ADAS), improving vehicle safety and performance.
  • Data Centers: Utilized in data processing units for managing large volumes of information with high throughput and low latency, enhancing server capabilities and cloud computing efficiency.
  • Industrial Automation: Supports high levels of control and precision in robotics and automated production lines, optimizing manufacturing processes and reducing time to market.
  • Consumer Electronics: Employs in devices like high-definition multimedia interfaces (HDMI) and virtual reality systems to enhance user experience through accelerated graphics processing.
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