DSPIC33FJ32GP202-E/MM
- Mfr.Part #
- DSPIC33FJ32GP202-E/MM
- Manufacturer
- Microchip Technology
- Package / Case
- 28-VQFN Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 16BIT 32KB FLASH 28QFN
- Stock
- 8,898
- In Stock :
- 8,898
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Mounting Style :
- SMD/SMT
- Operating Supply Voltage (Typ) :
- 3.3(V)
- Package Shape :
- Square
- Lead Free :
- Lead Free
- Device Core Size :
- 16(b)
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Interface :
- I2C, IrDA, LIN, SPI, UART, USART
- Number of Terminations :
- 28
- Peak Reflow Temperature (Cel) :
- 260
- Qualification :
- AEC-Q100
- Supply Current-Max :
- 80 mA
- Bit Size :
- 16
- Published :
- 2009
- Memory Size :
- 32kB
- Terminal Pitch :
- 0.65mm
- Schedule B :
- 8542310000, 8542310000/8542310000/8542310000/8542310000/8542310000
- HTS Code :
- 8542.31.00.01
- Package Type :
- QFN-S EP
- Operating Temp Range :
- -40C to 125C
- Interface Type :
- I2C/SPI/UART
- Number of Timers/Counters :
- 3
- Max Frequency :
- 40 MHz
- Length :
- 6mm
- CPU Family :
- PIC
- Interfaces :
- I2C/SPI/UART
- Core Architecture :
- dsPIC
- Connectivity :
- I2C, IrDA, LINbus, SPI, UART/USART
- Number of Terminals :
- 28
- PWM Channels :
- yes
- Power Supplies :
- 3.3 V
- Surface Mount :
- yes
- Program Memory Size :
- 32KB 32K x 8
- Base Product Number :
- DSPIC33FJ32GP202
- Package / Case :
- 28-VQFN Exposed Pad
- Pin Count :
- 28
- JESD-609 Code :
- e3
- Supply Voltage :
- 3.3V
- Terminal Position :
- QUAD
- Factory Lead Time :
- 13 Weeks
- Height Seated (Max) :
- 1mm
- Product Category :
- Digital Signal Processors and Controllers - DSP, DSC
- Base Part Number :
- DSPIC33FJ32GP202
- DMA Channels :
- No
- ECCN Code :
- 3A991.A.2
- JESD-30 Code :
- S-PQCC-N28
- Frequency :
- 40MHz
- Operating Supply Voltage (Max) :
- 3.6(V)
- Mounting :
- Surface Mount
- Mounting Type :
- Surface Mount
- Number of Programmable I/O :
- 21
- Tradename :
- dsPIC
- Number of I/O Lines :
- 21
- Maximum Operating Temperature :
- + 125 C
- Mount :
- Surface Mount
- Operating Supply Voltage :
- 3.3V
- Operating Temperature (Max) :
- 125C
- Rad Hardened :
- No
- Operating Temperature :
- -40°C~125°C TA
- Memory Type :
- Flash
- Voltage - Supply (Vcc/Vdd) :
- 3V~3.6V
- Operating Supply Voltage (Min) :
- 3(V)
- Number of Timers - General Purpose :
- 3
- Operating Temperature (Min) :
- -40C
- Seated Height-Max :
- 1 mm
- Data Bus Width :
- 16b
- ROM Programmability :
- Flash
- Program Memory Type :
- Flash
- Min Supply Voltage :
- 2.7 V
- Minimum Operating Temperature :
- - 40 C
- Speed :
- 40 MIPs
- Data Converters :
- A/D 10x10b/12b
- Peripherals :
- Brown-out Detect/Reset, DCI, DMA, I2S, POR, PWM, WDT
- Series :
- Automotive, AEC-Q100, dsPIC™ 33F
- RAM (bytes) :
- 2048
- DAC Channels :
- No
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER
- Manufacturer :
- Microchip
- Clock Freq :
- 40(MHz)
- # I/Os (Max) :
- 21
- Product :
- DSCs
- Max Operating Temperature :
- 125 °C
- Core Size :
- 16-Bit
- Radiation Hardening :
- No
- Programmable :
- yes
- Has ADC :
- yes
- Reach Compliance Code :
- Compliant
- Brand :
- Microchip Technology / Atmel
- Max Supply Voltage :
- 3.9 V
- Height :
- 0.88 mm
- Oscillator Type :
- Internal
- Packaging :
- Tube
- RAM Size :
- 2K x 8
- Package :
- Tube
- Supplier Device Package :
- 28-QFN-S (6x6)
- Terminal Form :
- NO LEAD
- Number of Pins :
- 28
- RoHS Status :
- ROHS3 Compliant
- Product Type :
- DSP - Digital Signal Processors and Controllers
- Min Operating Temperature :
- -40 °C
- Device Core :
- dsPIC
- Data Converter :
- A/D 10x10b/12b
- Instruction Set Architecture :
- RISC
- Watchdog Timer :
- yes
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Number of I/O :
- 21
- Core Processor :
- dsPIC
- Width :
- 6 mm
- Number of Cores :
- 1 Core
- Operating Temperature Classification :
- Automotive
- Time@Peak Reflow Temperature-Max (s) :
- 40
- EEPROM Size :
- --
- Number of I/Os :
- 21 I/O
- Total Internal Ram Size :
- 2KB(kB)
- ROM (words) :
- 32768
- Temperature Grade :
- Automotive
- RoHS :
- Compliant
- Product Status :
- Active
- Lifecycle Status :
- Production (Last Updated: 2 years ago)
- Pbfree Code :
- yes
- Datasheets
- DSPIC33FJ32GP202-E/MM
DSPIC33FJ32GP202-E/MM Documents

Microcontrollers Microchip Technology DSPIC33FJ32GP202-E/MM Overview
The DSPIC33FJ32GP202-E/MM by Microchip Technology is a cutting-edge microcontroller unit (MCU) designed for high-performance applications requiring sophisticated control and robust operation in a compact footprint. As a key component in the Microcontrollers category, this 16-bit MCU integrates 32KB of flash memory and a wide array of functionalities into a 28QFN package, offering a perfect blend of power and precision. This makes it an ideal choice for designers looking to enhance system efficiency and reliability in space-constrained environments. The Microcontrollers Microchip Technology DSPIC33FJ32GP202-E/MM is engineered to address the increasing demands of advanced electronics, providing a scalable solution for complex applications.
DSPIC33FJ32GP202-E/MM Features
The DSPIC33FJ32GP202-E/MM boasts several features that stand out in its class:
- 16-bit digital signal controller (DSC) with high-performance processing capabilities.
- 32KB of Flash memory, enabling robust applications and firmware updates.
- Low-power consumption modes for energy efficiency.
- Enhanced peripheral set for versatile I/O options.
- Operates at temperatures ranging from -40°C to 85°C, ensuring reliability in harsh environments.
- Small form factor (28QFN package) suitable for compact designs.
DSPIC33FJ32GP202-E/MM Applications
- Automotive Systems: Utilized in engine management systems and advanced driver assistance systems (ADAS) to provide reliable processing in real-time automotive applications.
- Industrial Automation: Powers control systems for machinery and production lines, enhancing operational efficiency and precision.
- Consumer Electronics: Serves as the core processing unit in high-performance portable devices, including gaming consoles and smart wearables.
- Medical Devices: Deployed in small-scale medical monitoring tools that require high data accuracy and low power consumption.
- Communication Systems: Used in network devices for processing signals and managing data transfers efficiently in communication infrastructures.
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