DSPIC33EV32GM102T-I/MM

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Mfr.Part #
DSPIC33EV32GM102T-I/MM
Manufacturer
Microchip Technology
Package / Case
28-VQFN Exposed Pad
Datasheet
Download
Description
IC MCU 16BIT 32KB FLASH 28QFN
Stock
12,020
In Stock :
12,020

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Product :
DSCs
Number of I/Os :
21
RoHS :
Compliant
Package :
Tape and Reel (TR)
Product Type :
DSP - Digital Signal Processors and Controllers
Interface Type :
Serial
Number of Timers/Counters :
7 Timer
Data Converter :
A/D 11x10/12b
Speed :
70 MIPs
Maximum Operating Temperature :
+ 85 C
Mounting Type :
Surface Mount
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Lifecycle Status :
Production (Last Updated: 2 years ago)
Memory Size :
32kB
Program Memory Size :
32KB 11K x 24
Mounting Style :
SMD/SMT
Max Operating Temperature :
85°C
Published :
2016
Interface :
CAN, I2C, IrDA, LIN, SPI, UART, USART
Connectivity :
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Core Processor :
dsPIC
Brand :
Microchip Technology
Program Memory Type :
Flash
Voltage - Supply (Vcc/Vdd) :
4.5V~5.5V
Data Converters :
A/D 11x10/12b
Peripherals :
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Operating Temperature :
-40°C~85°C TA
Operating Supply Voltage :
4.5 V to 5.5 V
Packaging :
Tape and Reel (TR)
Base Product Number :
DSPIC33EV32GM102
Package / Case :
28-VQFN Exposed Pad
Core Size :
16-Bit
Min Operating Temperature :
-40°C
Manufacturer :
Microchip
Supplier Device Package :
28-QFN-S (6x6)
Memory Type :
Flash
Oscillator Type :
Internal
Data Bus Width :
16 bit
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of I/O :
21
EEPROM Size :
--
Tradename :
dsPIC
Interfaces :
CAN/I2C/SPI/UART
RoHS Status :
ROHS3 Compliant
Series :
dsPIC™ 33EV
Minimum Operating Temperature :
- 40 C
RAM Size :
4K x 8
Core Architecture :
dsPIC
Base Part Number :
DSPIC33EV32GM1
Subcategory :
Embedded Processors and Controllers
Number of Cores :
1 Core
Factory Lead Time :
14 Weeks
Product Status :
Active
Qualification :
AEC-Q100
Introducing Microcontrollers Microchip Technology DSPIC33EV32GM102T-I/MM from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Package / Case:28-VQFN Exposed Pad, Base Part Number:DSPIC33EV32GM1, DSPIC33EV32GM102T-I/MM pinout, DSPIC33EV32GM102T-I/MM datasheet PDF, DSPIC33EV32GM102T-I/MM amp .Beyond Microcontrollers Microchip Technology DSPIC33EV32GM102T-I/MM ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EV32GM102T-I/MM


Microcontrollers Microchip Technology DSPIC33EV32GM102T-I/MM Overview

Introducing the DSPIC33EV32GM102T-I/MM from Microchip Technology, a robust 16-bit microcontroller unit (MCU) that integrates powerful features into a compact 28QFN package. This product is specifically designed for advanced applications requiring a mix of high performance, low power consumption, and minimal footprint. The DSPIC33EV32GM102T-I/MM excels in delivering efficient operation with its 32KB flash memory, making it a perfect choice for designers focusing on innovation in smart embedded systems. The integration of versatile peripherals and the ability to operate in extended temperatures make it an ideal component for demanding applications. Enhance your product designs with the reliability and advanced capabilities of the Microcontrollers Microchip Technology DSPIC33EV32GM102T-I/MM.

DSPIC33EV32GM102T-I/MM Features

  • 16-bit Digital Signal Controller (DSC) architecture.
  • 32KB of flash memory for robust application storage.
  • Dual partition flash with live update capability for uninterrupted operation.
  • Low-power management modes for energy efficiency.
  • High-speed PWM modules and ADC for precise control and monitoring.
  • Enhanced CAN and serial communication interfaces.
  • Operational in extended temperature ranges, suitable for industrial environments.

DSPIC33EV32GM102T-I/MM Applications

  • Automotive Systems: Utilized in engine control units and automotive sensors for reliable performance under harsh conditions.
  • Industrial Automation: Ideal for managing automated processes in manufacturing lines, ensuring high precision and control.
  • Consumer Electronics: Embedded in smart home devices and wearable technology, providing efficient power management and connectivity.
  • Telecommunication Equipment: Supports advanced communication protocols, enhancing data transmission capabilities in network hardware.
  • Medical Devices: Powers patient monitoring systems and diagnostic equipment with its reliable computing power and real-time capabilities.
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