DSPIC33EV256GM002-E/SP

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Mfr.Part #
DSPIC33EV256GM002-E/SP
Manufacturer
Microchip Technology
Package / Case
28-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC MCU 16BIT 256KB FLASH 28SPDIP
Stock
7,408
In Stock :
7,408

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Data Converters :
A/D 11x10/12b
Operating Temperature :
-40°C~125°C TA
Published :
2016
Oscillator Type :
Internal
Interfaces :
I2C/SPI/UART/USB
Data Converter :
A/D 11x10/12b
Peripherals :
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Mounting Type :
Through Hole
Program Memory Type :
Flash
Packaging :
Tube
Number of I/O :
21
Package / Case :
28-DIP (0.300, 7.62mm)
Interface :
I2C, IrDA, LIN, SPI, UART, USART
EEPROM Size :
--
Base Part Number :
DSPIC33EV256GM0
Speed :
60 MIPs
Memory Size :
256KB
Memory Type :
Flash
Base Product Number :
DSPIC33EV256GM002
RoHS Status :
ROHS3 Compliant
Core Architecture :
dsPIC
Data Bus Width :
16b
Moisture Sensitivity Level (MSL) :
Not Applicable
Min Operating Temperature :
-40°C
Voltage - Supply (Vcc/Vdd) :
4.5V~5.5V
Factory Lead Time :
20 Weeks
Core Processor :
dsPIC
Core Size :
16-Bit
Program Memory Size :
256KB 85.5K x 24
RAM Size :
16K x 8
Product Status :
Active
Package :
Tube
Connectivity :
I2C, IrDA, LINbus, SPI, UART/USART
Series :
Automotive, AEC-Q100, dsPIC™ 33EV
Max Operating Temperature :
125°C
Supplier Device Package :
28-SPDIP
Introducing Microcontrollers Microchip Technology DSPIC33EV256GM002-E/SP from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~125°C TA, Mounting Type:Through Hole, Package / Case:28-DIP (0.300, 7.62mm), Base Part Number:DSPIC33EV256GM0, DSPIC33EV256GM002-E/SP pinout, DSPIC33EV256GM002-E/SP datasheet PDF, DSPIC33EV256GM002-E/SP amp .Beyond Microcontrollers Microchip Technology DSPIC33EV256GM002-E/SP ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EV256GM002-E/SP


Microcontrollers Microchip Technology DSPIC33EV256GM002-E/SP Overview

The DSPIC33EV256GM002-E/SP by Microchip Technology stands out as a highly versatile and efficient microcontroller unit (MCU) designed for sophisticated real-time embedded systems. As part of the dsPIC33E series, this device integrates robust features into a compact 28-SPDIP package, making it an ideal choice for developers seeking a combination of performance, memory, and extended functionality. This microcontroller bridges the gap between traditional microcontrollers and digital signal processors, thus enabling it to handle complex algorithms and multitasking operations. The integration of 256KB of flash memory ensures ample space for application code and data storage, which is crucial for advanced applications requiring frequent updates and high data throughput.

DSPIC33EV256GM002-E/SP Features

This DSPIC33EV256GM002-E/SP MCU features a 16-bit architecture that allows for robust performance in demanding applications. Key features include 256KB of flash memory, high-speed PWM modules, and multiple serial communication interfaces like I2C, SPI, and UART. Enhanced with a 12-bit analog-to-digital converter (ADC), the MCU provides precise sensor signal processing capabilities, which are essential for real-time monitoring and control systems. Additional functionalities such as the DMA controller streamline data transfers without burdening the CPU, facilitating more efficient process handling in complex embedded designs.

DSPIC33EV256GM002-E/SP Applications

  • Automotive Systems: Utilized in engine management and dashboard display systems, where its robust processing capabilities ensure reliable real-time operation and interface management.
  • Industrial Automation: Powers complex machinery controls, such as robotic arms and process automation systems, where precise ADC inputs and high-speed communication interfaces facilitate enhanced operational accuracy and connectivity.
  • Consumer Electronics: Ideal for high-performance, user-interactive devices like smart home appliances and multimedia systems, where its large memory and high-speed processing capabilities provide improved user experiences and feature-rich applications.
  • Communication Systems: Deployed in telecommunication infrastructures, supporting signal processing and data transmission tasks that require high reliability and low-latency communication.
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