DSPIC33EP64MC506-E/MR

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Mfr.Part #
DSPIC33EP64MC506-E/MR
Manufacturer
Microchip Technology
Package / Case
64-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 16BIT 64KB FLASH 64VQFN
Stock
49,265
In Stock :
49,265

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
JESD-609 Code :
e3
Product Status :
Active
Interface Type :
I2C, SPI, UART
EEPROM Size :
--
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Operating Temperature :
-40°C~125°C TA
Package / Case :
64-VFQFN Exposed Pad
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
40
ROM (words) :
21845
Supply Voltage :
3.3V
Maximum Operating Temperature :
+ 125 C
Surface Mount :
yes
Tradename :
dsPIC
Lifecycle Status :
Production (Last Updated: 2 years ago)
RAM Size :
4K x 16
DMA Channels :
yes
Program Memory Size :
64KB 22K x 24
Series :
Automotive, AEC-Q100, dsPIC™ 33EP
Number of Timers/Counters :
5
Number of Pins :
64
Power Supplies :
3.3 V
Min Operating Temperature :
-40 °C
RAM (words) :
4096
Height Seated (Max) :
1mm
Supplier Device Package :
64-QFN (9x9)
PWM Channels :
yes
Qualification :
AEC-Q100
Terminal Position :
QUAD
Manufacturer :
Microchip
Base Part Number :
DSPIC33EP64MC506
Interfaces :
CAN/I2C/SPI/UART
Oscillator Type :
Internal
Terminal Pitch :
0.5 mm
Data Converters :
A/D 16x10b/12b
Product Type :
DSP - Digital Signal Processors and Controllers
Minimum Operating Temperature :
- 40 C
Temperature Grade :
Automotive
Base Product Number :
DSPIC33EP64MC506
Mounting Style :
SMD/SMT
Peak Reflow Temperature (Cel) :
260
Watchdog Timer :
yes
Bit Size :
16
Supply Current-Max :
150 mA
Peripherals :
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O Lines :
53
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Terminal Finish :
Matte Tin (Sn) - annealed
Data Bus Width :
16b
Min Supply Voltage :
2.95 V
Core Processor :
dsPIC
Operating Supply Voltage :
3.3V
Pin Count :
64
Factory Lead Time :
21 Weeks
Number of I/Os :
53 I/O
Package Shape :
Square
Number of Terminals :
64
Qualification Status :
Not Qualified
Published :
2012
Interface :
CAN, I2C, IrDA, LIN, SPI, UART, USART
RoHS :
Compliant
Radiation Hardening :
No
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
Memory Size :
64KB
Mount :
Surface Mount
Brand :
Microchip Technology
Connectivity :
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Number of Terminations :
64
On Chip Program ROM Width :
24
Format :
FLOATING-POINT
Reach Compliance Code :
Compliant
DAC Channels :
No
Seated Height-Max :
1 mm
Core Size :
16-Bit
Has ADC :
yes
RoHS Status :
ROHS3 Compliant
Packaging :
Tube
Memory Type :
Flash
HTS Code :
8542.31.00.01
Core Architecture :
dsPIC
Terminal Form :
NO LEAD
Program Memory Type :
Flash
Length :
9mm
Package :
Tube
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Max Supply Voltage :
3.6 V
Frequency :
60MHz
Number of I/O :
53
Data Converter :
A/D 16x10b/12b
ECCN Code :
3A001.A.3
Width :
9 mm
RAM (bytes) :
8192
Number of Programmable I/O :
53
Max Operating Temperature :
125 °C
Number of Cores :
1 Core
Speed :
60 MIPs
Max Frequency :
60 MHz
ROM Programmability :
Flash
JESD-30 Code :
S-PQCC-N64
Product :
DSCs
Supply Voltage-Max (Vsup) :
3.6V
Introducing Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~125°C TA, Package / Case:64-VFQFN Exposed Pad, Mounting Type:Surface Mount, Number of Pins:64, Base Part Number:DSPIC33EP64MC506, Number of Terminations:64, DSPIC33EP64MC506-E/MR pinout, DSPIC33EP64MC506-E/MR datasheet PDF, DSPIC33EP64MC506-E/MR amp .Beyond Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EP64MC506-E/MR


Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR Overview

The Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR is a high-performance, 16-bit microcontroller that combines efficient processing with advanced features designed to meet the rigorous demands of modern embedded systems. Developed by Microchip Technology, this microcontroller utilizes DSP and MCU capabilities, making it ideal for applications that require complex algorithms and real-time processing. With 64KB of flash memory and versatile peripherals, this microcontroller is a powerful solution for designers looking to enhance system functionality while maintaining cost and power efficiency.

DSPIC33EP64MC506-E/MR Features

This microcontroller is equipped with multiple features that enhance its functionality in complex embedded systems:

  • 16-bit digital signal processing core for high-speed computation.
  • 64KB of flash memory, providing ample space for application code and data storage.
  • Dual partition flash with live update capability, allowing firmware upgrades with zero downtime.
  • Advanced analog features, including ADCs, DACs, and comparators, suitable for precision sensing applications.
  • Multiple communication interfaces such as I2C, SPI, UART, and CAN for flexible connectivity options.
  • Extended temperature range, ensuring reliable operation under extreme conditions.

DSPIC33EP64MC506-E/MR Applications

  • Industrial Automation: Utilized in controlling machinery and processes in factories, where its robust operational capabilities enable precise control and communication in industrial environments.
  • Automotive Systems: Employed in automotive applications for engine management and safety features, leveraging its processing power and real-time capabilities to ensure optimal vehicle performance and reliability.
  • Consumer Electronics: Integrated into devices like smart home systems and multimedia appliances, where its ability to handle complex algorithms improves functionality and user experience.
  • Medical Devices: Applied in medical diagnostic equipment and monitoring systems, using its precision analog capabilities and reliable performance in critical healthcare devices.
  • Communication Systems: Essential for telecommunications infrastructure, where its high-speed interfaces and processing power facilitate efficient data handling and connectivity.
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