DSPIC33EP64MC506-E/MR

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Mfr.Part #
DSPIC33EP64MC506-E/MR
Manufacturer
Microchip Technology
Package / Case
64-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 16BIT 64KB FLASH 64VQFN
Stock
49,265
In Stock :
49,265

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
DAC Channels :
No
Data Converter :
A/D 16x10b/12b
Length :
9mm
Interfaces :
CAN/I2C/SPI/UART
EEPROM Size :
--
Maximum Operating Temperature :
+ 125 C
Base Part Number :
DSPIC33EP64MC506
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
Minimum Operating Temperature :
- 40 C
Operating Temperature :
-40°C~125°C TA
Core Architecture :
dsPIC
Qualification :
AEC-Q100
Series :
Automotive, AEC-Q100, dsPIC™ 33EP
Published :
2012
Interface :
CAN, I2C, IrDA, LIN, SPI, UART, USART
Product :
DSCs
Program Memory Type :
Flash
Tradename :
dsPIC
Mounting Style :
SMD/SMT
Brand :
Microchip Technology
PWM Channels :
yes
Speed :
60 MIPs
Number of Terminals :
64
Height Seated (Max) :
1mm
Power Supplies :
3.3 V
Number of Programmable I/O :
53
Number of Pins :
64
ECCN Code :
3A001.A.3
Bit Size :
16
Data Bus Width :
16b
Terminal Form :
NO LEAD
Supply Voltage :
3.3V
Has ADC :
yes
Time@Peak Reflow Temperature-Max (s) :
40
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Product Status :
Active
Supplier Device Package :
64-QFN (9x9)
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Number of Timers/Counters :
5
Memory Type :
Flash
Pin Count :
64
Max Frequency :
60 MHz
Data Converters :
A/D 16x10b/12b
DMA Channels :
yes
Core Processor :
dsPIC
Max Operating Temperature :
125 °C
Terminal Position :
QUAD
RoHS :
Compliant
Factory Lead Time :
21 Weeks
Package Shape :
Square
Terminal Pitch :
0.5 mm
ROM Programmability :
Flash
Packaging :
Tube
Peripherals :
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Qualification Status :
Not Qualified
Interface Type :
I2C, SPI, UART
RoHS Status :
ROHS3 Compliant
Watchdog Timer :
yes
Reach Compliance Code :
Compliant
Memory Size :
64KB
Number of I/Os :
53 I/O
Min Operating Temperature :
-40 °C
RAM (bytes) :
8192
RAM Size :
4K x 16
Package / Case :
64-VFQFN Exposed Pad
ROM (words) :
21845
Surface Mount :
yes
Format :
FLOATING-POINT
HTS Code :
8542.31.00.01
Temperature Grade :
Automotive
Width :
9 mm
Supply Current-Max :
150 mA
Mount :
Surface Mount
Number of I/O Lines :
53
On Chip Program ROM Width :
24
Operating Supply Voltage :
3.3V
Lifecycle Status :
Production (Last Updated: 2 years ago)
Package :
Tube
RAM (words) :
4096
Number of I/O :
53
Min Supply Voltage :
2.95 V
Oscillator Type :
Internal
Connectivity :
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Supply Voltage-Max (Vsup) :
3.6V
Core Size :
16-Bit
Seated Height-Max :
1 mm
Mounting Type :
Surface Mount
Frequency :
60MHz
Base Product Number :
DSPIC33EP64MC506
Max Supply Voltage :
3.6 V
Program Memory Size :
64KB 22K x 24
Manufacturer :
Microchip
Product Type :
DSP - Digital Signal Processors and Controllers
JESD-609 Code :
e3
Terminal Finish :
Matte Tin (Sn) - annealed
Peak Reflow Temperature (Cel) :
260
JESD-30 Code :
S-PQCC-N64
Number of Terminations :
64
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Radiation Hardening :
No
Number of Cores :
1 Core
Introducing Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:DSPIC33EP64MC506, Operating Temperature:-40°C~125°C TA, Number of Pins:64, Package / Case:64-VFQFN Exposed Pad, Mounting Type:Surface Mount, Number of Terminations:64, DSPIC33EP64MC506-E/MR pinout, DSPIC33EP64MC506-E/MR datasheet PDF, DSPIC33EP64MC506-E/MR amp .Beyond Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EP64MC506-E/MR


Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR Overview

The Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR is a high-performance, 16-bit microcontroller that combines efficient processing with advanced features designed to meet the rigorous demands of modern embedded systems. Developed by Microchip Technology, this microcontroller utilizes DSP and MCU capabilities, making it ideal for applications that require complex algorithms and real-time processing. With 64KB of flash memory and versatile peripherals, this microcontroller is a powerful solution for designers looking to enhance system functionality while maintaining cost and power efficiency.

DSPIC33EP64MC506-E/MR Features

This microcontroller is equipped with multiple features that enhance its functionality in complex embedded systems:

  • 16-bit digital signal processing core for high-speed computation.
  • 64KB of flash memory, providing ample space for application code and data storage.
  • Dual partition flash with live update capability, allowing firmware upgrades with zero downtime.
  • Advanced analog features, including ADCs, DACs, and comparators, suitable for precision sensing applications.
  • Multiple communication interfaces such as I2C, SPI, UART, and CAN for flexible connectivity options.
  • Extended temperature range, ensuring reliable operation under extreme conditions.

DSPIC33EP64MC506-E/MR Applications

  • Industrial Automation: Utilized in controlling machinery and processes in factories, where its robust operational capabilities enable precise control and communication in industrial environments.
  • Automotive Systems: Employed in automotive applications for engine management and safety features, leveraging its processing power and real-time capabilities to ensure optimal vehicle performance and reliability.
  • Consumer Electronics: Integrated into devices like smart home systems and multimedia appliances, where its ability to handle complex algorithms improves functionality and user experience.
  • Medical Devices: Applied in medical diagnostic equipment and monitoring systems, using its precision analog capabilities and reliable performance in critical healthcare devices.
  • Communication Systems: Essential for telecommunications infrastructure, where its high-speed interfaces and processing power facilitate efficient data handling and connectivity.
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