DSPIC33EP64GP502-I/SP

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Mfr.Part #
DSPIC33EP64GP502-I/SP
Manufacturer
Microchip Technology
Package / Case
28-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC MCU 16BIT 64KB FLASH 28SPDIP
Stock
15
In Stock :
15

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
RAM Size :
4K x 16
Bit Size :
16
Terminal Position :
Dual
Reach Compliance Code :
Compliant
Operating Supply Voltage (Min) :
3(V)
Number of I/Os :
21 I/O
JESD-30 Code :
R-PDIP-T28
ECCN Code :
3A991.A.2
Brand :
Microchip Technology
Length :
34.671mm
DMA Channels :
yes
HTS Code :
8542.31.00.01
Interface :
CAN, I2C, IrDA, LIN, SPI, UART, USART
Data Bus Width :
16b
Base Part Number :
DSPIC33EP64GP502
Number of I/O :
21
Temperature Grade :
Industrial
Power Supplies :
3.3 V
Series :
dsPIC™ 33EP
Number of Timers/Counters :
5
# I/Os (Max) :
21
Number of Terminals :
28
Manufacturer :
Microchip
Frequency :
70MHz
DAC Channels :
No
Product :
DSCs
Clock Freq :
70(MHz)
Format :
FLOATING-POINT
Maximum Operating Temperature :
+ 85 C
Data Converter :
A/D 6x10b/12b
Mounting Style :
Through Hole
Core Size :
16-Bit
EEPROM Size :
--
Peripherals :
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O Lines :
21
JESD-609 Code :
e3
Supply Voltage-Max (Vsup) :
3.6V
Terminal Finish :
Matte Tin (Sn) - annealed
Operating Temperature Classification :
Industrial
RoHS :
Details
Supplier Device Package :
28-SPDIP
Speed :
70 MIPs
Package Shape :
RECTANGULAR
Mounting Type :
Through Hole
Peak Reflow Temperature (Cel) :
Not Applicable
Core Processor :
dsPIC
Device Core Size :
16(b)
Programmable :
yes
Package / Case :
28-DIP (0.300, 7.62mm)
Interface Type :
CAN/I2C/SPI/UART
Number of Terminations :
28
Supply Current-Max :
150 mA
Surface Mount :
No
Radiation Hardening :
No
Product Type :
DSP - Digital Signal Processors and Controllers
Number of Cores :
1 Core
Total Internal Ram Size :
8KB(kB)
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Number of Timers - General Purpose :
5
PWM Channels :
yes
Operating Temperature :
-40°C~85°C TA
RoHS Status :
ROHS3 Compliant
Operating Supply Voltage :
3.3V
On Chip Program ROM Width :
24
Operating Supply Voltage (Typ) :
3.3(V)
Program Memory Size :
64KB 22K x 24
Operating Temperature (Min) :
-40C
Data Converters :
A/D 6x10b/12b
Operating Supply Voltage (Max) :
3.6(V)
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mounting :
Through Hole
Terminal Form :
THROUGH-HOLE
Oscillator Type :
Internal
Package Type :
SPDIP
Number of Pins :
28
Base Product Number :
DSPIC33EP64GP502
Factory Lead Time :
21 Weeks
Watchdog Timer :
yes
Pin Count :
28
Operating Temperature (Max) :
85C
Published :
2012
Qualification :
AEC-Q100
Operating Temp Range :
-40C to 85C
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
Memory Size :
64KB
Terminal Pitch :
2.54 mm
Width :
7.62 mm
Rad Hardened :
No
ROM Programmability :
Flash
Has ADC :
yes
ROM (words) :
21845
Device Core :
dsPIC
Tradename :
dsPIC
Instruction Set Architecture :
RISC
Seated Height-Max :
5.08 mm
Package :
Tube
RAM (bytes) :
8192
Minimum Operating Temperature :
- 40 C
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Interfaces :
CAN/I2C/SPI/UART
Program Memory Type :
Flash
Product Status :
Active
Supply Voltage :
3.3V
Qualification Status :
Not Qualified
Packaging :
Tube
RAM (words) :
4096
Introducing Microcontrollers Microchip Technology DSPIC33EP64GP502-I/SP from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:DSPIC33EP64GP502, Mounting Type:Through Hole, Package / Case:28-DIP (0.300, 7.62mm), Number of Terminations:28, Operating Temperature:-40°C~85°C TA, Number of Pins:28, DSPIC33EP64GP502-I/SP pinout, DSPIC33EP64GP502-I/SP datasheet PDF, DSPIC33EP64GP502-I/SP amp .Beyond Microcontrollers Microchip Technology DSPIC33EP64GP502-I/SP ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EP64GP502-I/SP


Microcontrollers Microchip Technology DSPIC33EP64GP502-I/SP Overview

Introducing the DSPIC33EP64GP502-I/SP from Microchip Technology, a robust microcontroller unit (MCU) that is designed to meet the intricate needs of advanced digital control systems. This powerful MCU is built on a high-performance 16-bit architecture and is housed in a 28-pin SPDIP package, offering a seamless blend of functionality and compactness. The DSPIC33EP64GP502-I/SP is equipped with 64KB of flash memory, providing substantial space for application code and data storage, making it a prime choice for developers looking for a combination of performance and memory capacity in their embedded solutions. This product stands out in the Microcontrollers Microchip Technology DSPIC33EP64GP502-I/SP category by offering enhanced features that cater to complex computational demands and support for real-time control applications.

DSPIC33EP64GP502-I/SP Features

The DSPIC33EP64GP502-I/SP boasts several key features that make it exceptionally versatile and suitable for a broad range of applications. It includes high-speed PWM modules, analog-to-digital converters (ADCs) with high resolution, and serial communication modules including UART, SPI, and I2C interfaces. The integration of these features ensures optimal performance in tasks requiring intensive processing and precision, such as advanced motor control, real-time data analysis, and connectivity with peripheral devices.

DSPIC33EP64GP502-I/SP Applications

  • Advanced Motor Control Systems: Utilizes its high-speed PWM outputs and robust processing capabilities to manage and optimize motor functions, enhancing efficiency and reliability in industrial automation.
  • Automotive Applications: Leverages its ADCs and communication interfaces to monitor environmental and engine parameters, improving vehicle dynamics and safety systems.
  • Consumer Electronics: Supports applications in smart home devices and portable electronics by managing sensor inputs and user interfaces, ensuring responsive and intuitive device behavior.
  • Communication Systems: Employs its serial communication capabilities to facilitate data exchange and protocol management in networked devices, strengthening data integrity and system connectivity.
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