DSPIC33EP32GP502-E/MM

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Mfr.Part #
DSPIC33EP32GP502-E/MM
Manufacturer
Microchip Technology
Package / Case
28-VQFN Exposed Pad
Datasheet
Download
Description
IC MCU 16BIT 32KB FLASH 28QFN
Stock
359
In Stock :
359

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
ROM Programmability :
Flash
Mount :
Surface Mount
JESD-30 Code :
S-PQCC-N28
Product Type :
DSP - Digital Signal Processors and Controllers
Number of Cores :
1 Core
Operating Supply Voltage :
3.3V
Watchdog Timer :
yes
Has ADC :
yes
Number of Timers/Counters :
5
RoHS :
Details
Number of Terminals :
28
Pin Count :
28
JESD-609 Code :
e3
Terminal Form :
NO LEAD
Package Shape :
Square
Published :
2011
Series :
Automotive, AEC-Q100, dsPIC™ 33EP
PWM Channels :
yes
Memory Size :
32kB
ECCN Code :
3A001.A.3
Terminal Pitch :
0.65 mm
Maximum Operating Temperature :
+ 125 C
Brand :
Microchip Technology / Atmel
DAC Channels :
No
Oscillator Type :
Internal
Mounting Style :
SMD/SMT
Packaging :
Tube
Qualification :
AEC-Q100
Program Memory Size :
32KB 10.7K x 24
Supplier Device Package :
28-QFN-S (6x6)
Supply Voltage-Max (Vsup) :
3.6V
Number of I/Os :
21 I/O
Factory Lead Time :
13 Weeks
EEPROM Size :
--
Reach Compliance Code :
Compliant
Data Converters :
A/D 6x10b/12b
Qualification Status :
Not Qualified
Height Seated (Max) :
1mm
Package :
Tube
Data Bus Width :
16b
Format :
FLOATING-POINT
Terminal Finish :
Matte Tin (Sn) - annealed
RoHS Status :
ROHS3 Compliant
On Chip Program ROM Width :
24
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Supply Current-Max :
150 mA
Base Part Number :
DSPIC33EP32GP502
RAM (words) :
2048
Length :
6mm
Number of Pins :
28
Interface Type :
I2C, SPI, UART
Peak Reflow Temperature (Cel) :
260
Core Processor :
dsPIC
Product :
DSCs
Interfaces :
CAN/I2C/SPI/UART
Base Product Number :
DSPIC33EP32GP502
Manufacturer :
Microchip
Temperature Grade :
Automotive
Bit Size :
16
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
Mounting Type :
Surface Mount
Supply Voltage :
3.3V
Power Supplies :
3.3 V
DMA Channels :
yes
Frequency :
70MHz
Product Status :
Active
Program Memory Type :
Flash
Radiation Hardening :
No
Data Converter :
A/D 6x10b/12b
Tradename :
dsPIC
HTS Code :
8542.31.00.01
Seated Height-Max :
1 mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Surface Mount :
yes
Width :
6 mm
Minimum Operating Temperature :
- 40 C
RAM (bytes) :
4096
Interface :
CAN, I2C, IrDA, LIN, SPI, UART, USART
Peripherals :
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Operating Temperature :
-40°C~125°C TA
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Number of I/O :
21
Terminal Position :
QUAD
Core Size :
16-Bit
Package / Case :
28-VQFN Exposed Pad
Number of Terminations :
28
Time@Peak Reflow Temperature-Max (s) :
40
Speed :
60 MHz
Number of I/O Lines :
21
RAM Size :
2K x 16
ROM (words) :
10922
Introducing Microcontrollers Microchip Technology DSPIC33EP32GP502-E/MM from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:DSPIC33EP32GP502, Number of Pins:28, Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C TA, Package / Case:28-VQFN Exposed Pad, Number of Terminations:28, DSPIC33EP32GP502-E/MM pinout, DSPIC33EP32GP502-E/MM datasheet PDF, DSPIC33EP32GP502-E/MM amp .Beyond Microcontrollers Microchip Technology DSPIC33EP32GP502-E/MM ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EP32GP502-E/MM


Microcontrollers Microchip Technology DSPIC33EP32GP502-E/MM Overview

The DSPIC33EP32GP502-E/MM from Microchip Technology represents a robust, highly integrated microcontroller (MCU) designed for demanding embedded applications. As part of the renowned dsPIC33E family, this device features a 16-bit digital signal controller architecture, providing a perfect blend of processing power and efficiency. With 32KB of flash memory and advanced peripheral integration, it supports complex algorithms and processing routines, making it ideal for high-performance applications across various industries. Its compact 28-QFN package is engineered for space-constrained applications, ensuring that despite its small size, no compromise on performance is made. The integration of DSPIC33EP32GP502-E/MM can significantly elevate system reliability and functionality, facilitating the development of advanced technological solutions.

DSPIC33EP32GP502-E/MM Features

  • 16-bit dsPIC33E microcontroller core for high-level computation and control.
  • 32KB of flash memory providing ample space for application code and data storage.
  • Dual partition flash with live update capability, allowing for seamless firmware upgrades.
  • Advanced motor control peripherals, suitable for precision control in industrial applications.
  • Integrated analog features such as ADCs, DACs, and comparators for enhanced sensor interfacing and feedback mechanisms.
  • High-speed PWM modules, crucial for power conversion and management.
  • Flexible communication interfaces including I2C, SPI, UARTs, and CAN for comprehensive system connectivity.
  • Low power consumption modes to ensure energy efficiency in portable and remote applications.

DSPIC33EP32GP502-E/MM Applications

  • Industrial Automation: Utilizes its robust I/O capabilities and high-speed PWM for controlling machinery and process automation.
  • Automotive Systems: Employs advanced motor control features for automotive subsystems such as power steering or fuel injection.
  • Consumer Electronics: Leverages its low power consumption and versatile peripheral set for smart home devices and portable electronics.
  • Medical Devices: Benefits from precise ADCs and DACs for critical medical monitoring and diagnostic equipment.
  • Communication Systems: Takes advantage of multiple communication interfaces for data transfer and control in complex communication infrastructures.
  • Renewable Energy Systems: Supports energy efficient applications in solar inverters and wind turbine controllers.
  • Robotics: Utilizes the high computation power and motor control peripherals for sophisticated robotic systems and drones.
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