DSPIC30F6011A-30I/PF

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Mfr.Part #
DSPIC30F6011A-30I/PF
Manufacturer
Microchip Technology
Package / Case
64-TQFP
Datasheet
Download
Description
IC MCU 16BIT 132KB FLASH 64TQFP
Stock
3,090
In Stock :
3,090

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
RAM (bytes) :
6144
Operating Supply Voltage :
5V
Packaging :
Tray
ROM (words) :
45056
JESD-30 Code :
S-PQFP-G64
ROM Programmability :
Flash
Product :
DSCs
Schedule B :
8542310000
Number of I/Os :
52
Max Supply Voltage :
5.5 V
Dimensions :
14 x 14 x 1.05mm
Max Operating Temperature :
85 °C
Radiation Hardening :
No
Data Bus Width :
16b
Mount :
Surface Mount
RAM (words) :
6144
Has ADC :
yes
Power Supplies :
3/5 V
Data Converter :
A/D 16x12b
On Chip Program ROM Width :
24
Base Part Number :
DSPIC30F6011A
DMA Channels :
No
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Lead Free :
Lead Free
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2004
Peripherals :
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Peak Reflow Temperature (Cel) :
260
Product Type :
DSP - Digital Signal Processors and Controllers
Qualification Status :
Not Qualified
Memory Type :
Flash
Maximum Operating Temperature :
+85 °C
Temperature Grade :
Industrial
Number of Ethernet Channels :
0
Manufacturer :
Microchip
Number of UART Channels :
2
RAM Size :
6K x 8
Supplier Device Package :
64-TQFP (14x14)
Family Name :
dsPIC30F
RoHS :
Compliant
Speed :
30 MIPs
Device Core :
dsPIC
Brand :
Microchip Technology
Max Frequency :
30 MHz
Supply Voltage :
5V
Format :
FIXED-POINT
Watchdog Timer :
yes
Core Processor :
dsPIC
Min Supply Voltage :
2.5 V
Memory Size :
132kB
Number of Cores :
1 Core
Number of Timers/Counters :
5
Mounting Style :
SMD/SMT
Supply Current-Max :
250 mA
Interface :
CAN, I2C, SPI, UART, USART
Series :
dsPIC™ 30F
Terminal Position :
QUAD
Width :
14mm
Product Status :
Active
Number of Programmable I/O :
52
Interface Type :
CAN, I2C, SPI, UART
Package Type :
TQFP
Time@Peak Reflow Temperature-Max (s) :
40
Instruction Set Architecture :
RISC
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
REACH SVHC :
No SVHC
Device Million Instructions per Second :
30MIPS
EEPROM Size :
2K x 8
DAC Channels :
No
Terminal Finish :
Matte Tin (Sn) - annealed
RoHS Status :
ROHS3 Compliant
Number of Pins :
64
Tradename :
dsPIC
Mounting Type :
Surface Mount
Number of I/O Lines :
52
Factory Lead Time :
2 Weeks
Terminal Pitch :
0.8mm
Program Memory Type :
Flash
Data Converters :
A/D 16x12b
Seated Height-Max :
1.2 mm
Pbfree Code :
yes
Package / Case :
64-TQFP
Typical Operating Supply Voltage :
2.5 to 5.5 V
Height :
1.05mm
Number of ADC Channels :
16
Lifecycle Status :
Production (Last Updated: 2 years ago)
Oscillator Type :
Internal
Number of I/O :
52
Number of I2C Channels :
1
Program Memory Size :
132KB 44K x 24
Frequency :
30MHz
Core Architecture :
dsPIC
Additional Feature :
ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ
Operating Temperature :
-40°C~85°C TA
ECCN Code :
3A991.A.2
Number of Timers :
5
PWM Channels :
yes
Bit Size :
16
Base Product Number :
DSPIC30F6011
Length :
14mm
HTS Code :
8542.31.00.01
Number of Terminations :
64
Surface Mount :
yes
Package Shape :
Square
Core Size :
16-Bit
Min Operating Temperature :
-40 °C
Density :
1 Mb
Number of SPI Channels :
2
Minimum Operating Temperature :
-40 °C
JESD-609 Code :
e3
Pin Count :
64
Package :
Tray
Interfaces :
CAN/I2C/SPI/UART
Terminal Form :
Gull wing
Number of Terminals :
64
Voltage - Supply (Vcc/Vdd) :
2.5V~5.5V
Reach Compliance Code :
Compliant
Introducing Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:DSPIC30F6011A, Number of Pins:64, Mounting Type:Surface Mount, Package / Case:64-TQFP, Operating Temperature:-40°C~85°C TA, Number of Terminations:64, DSPIC30F6011A-30I/PF pinout, DSPIC30F6011A-30I/PF datasheet PDF, DSPIC30F6011A-30I/PF amp .Beyond Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC30F6011A-30I/PF


Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF Overview

The DSPIC30F6011A-30I/PF from Microchip Technology stands as a robust microcontroller unit (MCU) tailored for advanced applications requiring high performance, reliability, and flexibility in programming. Designed with a 16-bit architecture and equipped with 132KB of flash memory, this MCU ensures ample space for complex applications and software updates. Its packaging in a 64-pin TQFP (Thin Quad Flat Package) allows for efficient space usage on PCBs, making it an excellent choice for sophisticated yet compact designs. The integration of this Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF into your design promises not only performance but also scalability and ease of development, positioning it as a cornerstone for innovative electronic systems.

DSPIC30F6011A-30I/PF Features

This MCU boasts a range of features designed to support demanding applications. Key features include:

  • High-Performance 16-bit Architecture: Ensures efficient processing and task handling, suitable for complex algorithms and multitasking environments.
  • 132KB Flash Memory: Provides substantial space for application code and data storage, facilitating advanced functionalities and updates without hardware changes.
  • Flexible Peripheral Set: Includes ADCs, PWM outputs, and communication interfaces like UART, SPI, and I2C, offering extensive integration capabilities with external devices.
  • Power Management Options: Features various power-saving modes to ensure optimal power efficiency, crucial for portable and remote applications.
  • Robust Design: Encased in a 64TQFP that ensures durability and reliability for industrial-grade applications.

DSPIC30F6011A-30I/PF Applications

  • Industrial Automation: Utilizes its robust I/O capabilities to manage multiple sensors and actuators, enhancing process controls and machine automation.
  • Automotive Systems: Employs its high processing power and real-time capabilities in engine management systems and automotive safety applications.
  • Medical Devices: Supports reliable and precise control necessary for medical diagnostic equipment and portable medical applications.
  • Telecommunication: Leverages its advanced communication interfaces for networked devices, enhancing data transmission and infrastructure management.
  • Consumer Electronics: Applied in smart home devices and complex user interfaces, providing the backbone for enhanced user experience and connectivity.
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