DSPIC30F6011A-30I/PF

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Mfr.Part #
DSPIC30F6011A-30I/PF
Manufacturer
Microchip Technology
Package / Case
64-TQFP
Datasheet
Download
Description
IC MCU 16BIT 132KB FLASH 64TQFP
Stock
3,090
In Stock :
3,090

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Additional Feature :
ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ
Surface Mount :
yes
Number of Ethernet Channels :
0
Bit Size :
16
Width :
14mm
Number of Programmable I/O :
52
Interface :
CAN, I2C, SPI, UART, USART
Speed :
30 MIPs
Reach Compliance Code :
Compliant
JESD-30 Code :
S-PQFP-G64
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Number of I/O :
52
Number of Terminations :
64
Temperature Grade :
Industrial
Peak Reflow Temperature (Cel) :
260
Max Operating Temperature :
85 °C
Terminal Form :
Gull wing
Lifecycle Status :
Production (Last Updated: 2 years ago)
Memory Type :
Flash
Program Memory Type :
Flash
Interface Type :
CAN, I2C, SPI, UART
PWM Channels :
yes
Pbfree Code :
yes
Length :
14mm
Product Type :
DSP - Digital Signal Processors and Controllers
Core Architecture :
dsPIC
Number of Pins :
64
Program Memory Size :
132KB 44K x 24
Brand :
Microchip Technology
Mounting Style :
SMD/SMT
ECCN Code :
3A991.A.2
Format :
FIXED-POINT
EEPROM Size :
2K x 8
Number of SPI Channels :
2
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Lead Free :
Lead Free
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Voltage - Supply (Vcc/Vdd) :
2.5V~5.5V
Terminal Pitch :
0.8mm
REACH SVHC :
No SVHC
Data Bus Width :
16b
Minimum Operating Temperature :
-40 °C
Number of I/Os :
52
Time@Peak Reflow Temperature-Max (s) :
40
Power Supplies :
3/5 V
Number of Timers :
5
Supplier Device Package :
64-TQFP (14x14)
Schedule B :
8542310000
On Chip Program ROM Width :
24
Min Operating Temperature :
-40 °C
Packaging :
Tray
Number of ADC Channels :
16
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Density :
1 Mb
RoHS :
Compliant
Watchdog Timer :
yes
Base Product Number :
DSPIC30F6011
Number of UART Channels :
2
Published :
2004
Radiation Hardening :
No
Core Processor :
dsPIC
Supply Current-Max :
250 mA
Has ADC :
yes
Supply Voltage :
5V
RAM Size :
6K x 8
Core Size :
16-Bit
ROM (words) :
45056
Device Million Instructions per Second :
30MIPS
Operating Supply Voltage :
5V
Package Shape :
Square
Series :
dsPIC™ 30F
HTS Code :
8542.31.00.01
Manufacturer :
Microchip
Data Converters :
A/D 16x12b
Package Type :
TQFP
Tradename :
dsPIC
Family Name :
dsPIC30F
DAC Channels :
No
Oscillator Type :
Internal
Peripherals :
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Product Status :
Active
Frequency :
30MHz
Typical Operating Supply Voltage :
2.5 to 5.5 V
Package :
Tray
Dimensions :
14 x 14 x 1.05mm
RAM (words) :
6144
Package / Case :
64-TQFP
Mount :
Surface Mount
Seated Height-Max :
1.2 mm
JESD-609 Code :
e3
Terminal Position :
QUAD
Memory Size :
132kB
Maximum Operating Temperature :
+85 °C
Height :
1.05mm
Operating Temperature :
-40°C~85°C TA
Instruction Set Architecture :
RISC
DMA Channels :
No
ROM Programmability :
Flash
Number of Cores :
1 Core
Number of Terminals :
64
Number of I/O Lines :
52
Number of I2C Channels :
1
Min Supply Voltage :
2.5 V
Max Supply Voltage :
5.5 V
RoHS Status :
ROHS3 Compliant
RAM (bytes) :
6144
Interfaces :
CAN/I2C/SPI/UART
Max Frequency :
30 MHz
Device Core :
dsPIC
Number of Timers/Counters :
5
Product :
DSCs
Factory Lead Time :
2 Weeks
Data Converter :
A/D 16x12b
Terminal Finish :
Matte Tin (Sn) - annealed
Base Part Number :
DSPIC30F6011A
Pin Count :
64
Introducing Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:64, Number of Pins:64, Package / Case:64-TQFP, Operating Temperature:-40°C~85°C TA, Base Part Number:DSPIC30F6011A, DSPIC30F6011A-30I/PF pinout, DSPIC30F6011A-30I/PF datasheet PDF, DSPIC30F6011A-30I/PF amp .Beyond Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC30F6011A-30I/PF


Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF Overview

The DSPIC30F6011A-30I/PF from Microchip Technology stands as a robust microcontroller unit (MCU) tailored for advanced applications requiring high performance, reliability, and flexibility in programming. Designed with a 16-bit architecture and equipped with 132KB of flash memory, this MCU ensures ample space for complex applications and software updates. Its packaging in a 64-pin TQFP (Thin Quad Flat Package) allows for efficient space usage on PCBs, making it an excellent choice for sophisticated yet compact designs. The integration of this Microcontrollers Microchip Technology DSPIC30F6011A-30I/PF into your design promises not only performance but also scalability and ease of development, positioning it as a cornerstone for innovative electronic systems.

DSPIC30F6011A-30I/PF Features

This MCU boasts a range of features designed to support demanding applications. Key features include:

  • High-Performance 16-bit Architecture: Ensures efficient processing and task handling, suitable for complex algorithms and multitasking environments.
  • 132KB Flash Memory: Provides substantial space for application code and data storage, facilitating advanced functionalities and updates without hardware changes.
  • Flexible Peripheral Set: Includes ADCs, PWM outputs, and communication interfaces like UART, SPI, and I2C, offering extensive integration capabilities with external devices.
  • Power Management Options: Features various power-saving modes to ensure optimal power efficiency, crucial for portable and remote applications.
  • Robust Design: Encased in a 64TQFP that ensures durability and reliability for industrial-grade applications.

DSPIC30F6011A-30I/PF Applications

  • Industrial Automation: Utilizes its robust I/O capabilities to manage multiple sensors and actuators, enhancing process controls and machine automation.
  • Automotive Systems: Employs its high processing power and real-time capabilities in engine management systems and automotive safety applications.
  • Medical Devices: Supports reliable and precise control necessary for medical diagnostic equipment and portable medical applications.
  • Telecommunication: Leverages its advanced communication interfaces for networked devices, enhancing data transmission and infrastructure management.
  • Consumer Electronics: Applied in smart home devices and complex user interfaces, providing the backbone for enhanced user experience and connectivity.
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