DSPIC30F3011-30I/P

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Mfr.Part #
DSPIC30F3011-30I/P
Manufacturer
Microchip Technology
Package / Case
40-DIP (0.600, 15.24mm)
Datasheet
Download
Description
IC MCU 16BIT 24KB FLASH 40DIP
Stock
3,839
In Stock :
3,839

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Bit Size :
16
Packaging :
Tube
Programmable :
yes
Base Part Number :
DSPIC30F3011
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Pin Count :
40
Rad Hardened :
No
Voltage - Supply (Vcc/Vdd) :
2.5V~5.5V
Interface Type :
I2C/SPI/UART
ROM Programmability :
Flash
Manufacturer :
Microchip
EEPROM Size :
1K x 8
Has ADC :
yes
JESD-609 Code :
e3
Seated Height-Max :
4.83 mm
Power Supplies :
3/5 V
Mount :
Through Hole
Number of Timers - General Purpose :
5
Data Bus Width :
16b
RAM (words) :
512
Program Memory Type :
Flash
Package / Case :
40-DIP (0.600, 15.24mm)
Package :
Tube
Oscillator Type :
Internal
RoHS Status :
ROHS3 Compliant
RAM (bytes) :
1024
Operating Temperature Classification :
Industrial
Total Internal Ram Size :
1KB(kB)
Family Name :
dsPIC30F
Height :
4.953mm
Minimum Operating Temperature :
- 40 C
# I/Os (Max) :
30
Brand :
Microchip Technology / Atmel
Watchdog Timer :
yes
Number of Cores :
1 Core
Number of I/O Lines :
30
Base Product Number :
DSPIC30F3011
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Peripherals :
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Data Converters :
A/D 9x10b
Format :
FIXED POINT
JESD-30 Code :
R-PDIP-T40
Number of UART Channels :
2
Operating Supply Voltage (Typ) :
3.3/5(V)
Density :
192 kB
Additional Feature :
ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ
PWM Channels :
yes
Frequency :
30MHz
Number of A/D Converters :
1
Mounting Type :
Through Hole
Number of PWM Channels :
6
DMA Channels :
No
Factory Lead Time :
6 Weeks
Pbfree Code :
yes
Operating Temperature (Max) :
85C
Number of Timers/Counters :
5
ROM (words) :
8192
On Chip Program ROM Width :
24
Published :
2007
Subcategory :
Embedded Processors and Controllers
Mounting :
Through Hole
Operating Temperature :
-40°C~85°C TA
Operating Supply Voltage (Max) :
5.5(V)
Maximum Operating Temperature :
+ 85 C
Number of Bits :
16
Mounting Style :
Through Hole
Qualification Status :
Not Qualified
REACH SVHC :
No SVHC
Terminal Finish :
Matte Tin (Sn)
Device Core :
dsPIC
Lead Free :
Lead Free
Technology :
CMOS
Interfaces :
I2C/SPI/UART
Operating Supply Voltage (Min) :
2.5(V)
Tradename :
dsPIC
Supplier Device Package :
40-PDIP
Core Processor :
dsPIC
ECCN Code :
3A991.A.2
Connectivity :
I2C, SPI, UART/USART
Number of ADC Channels :
9
Program Memory Size :
24KB 8K x 24
Terminal Pitch :
2.54 mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Length :
53.21mm
Data Converter :
A/D 9x10b
Surface Mount :
No
Clock Freq :
30(MHz)
Terminal Form :
THROUGH-HOLE
Radiation Hardening :
No
RoHS :
Details
Package Shape :
RECTANGULAR
Terminal Position :
Dual
Series :
dsPIC™ 30F
HTS Code :
8542.31.00.01
RAM Size :
1K x 8
Reach Compliance Code :
Compliant
Temperature Grade :
Industrial
Maximum Expanded Memory Size :
64KB
Interface :
I2C, SPI, UART, USART
Device Core Size :
16(b)
Product Type :
DSP - Digital Signal Processors and Controllers
Width :
14.732mm
Speed :
30 MIPs
Operating Temp Range :
-40C to 85C
Peak Reflow Temperature (Cel) :
Not Applicable
Number of I/O :
30
Product :
DSCs
Operating Supply Voltage :
2.5 V to 5.5 V
Product Status :
Active
Number of Pins :
40
DAC Channels :
No
Core Size :
16-Bit
Number of Terminals :
40
Package Type :
PDIP
Memory Size :
24KB
Instruction Set Architecture :
RISC
Operating Temperature (Min) :
-40C
Introducing Microcontrollers Microchip Technology DSPIC30F3011-30I/P from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:DSPIC30F3011, Package / Case:40-DIP (0.600, 15.24mm), Mounting Type:Through Hole, Operating Temperature:-40°C~85°C TA, Number of Pins:40, DSPIC30F3011-30I/P pinout, DSPIC30F3011-30I/P datasheet PDF, DSPIC30F3011-30I/P amp .Beyond Microcontrollers Microchip Technology DSPIC30F3011-30I/P ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC30F3011-30I/P


Microcontrollers Microchip Technology DSPIC30F3011-30I/P Overview

The DSPIC30F3011-30I/P from Microchip Technology is a highly versatile and powerful microcontroller unit (MCU) tailored for demanding applications that require robust performance in signal management and processing. This 16-bit MCU integrates a seamless blend of Flash memory and digital signal processing capabilities into a standard 40DIP package, making it an ideal choice for developers seeking flexibility and reliability in their electronic designs. The incorporation of 24KB Flash memory with advanced peripheral interfaces facilitates efficient design rollouts, while reducing development times and costs in high-performance environments. As a key product in the Microcontrollers category by Microchip Technology, the DSPIC30F3011-30I/P excels in delivering precise control and varied functionalities, supporting a broad spectrum of industrial, automotive, and communication applications.

DSPIC30F3011-30I/P Features

This microcontroller features a robust set of specifications including a 16-bit processing unit, 24KB of Flash memory, and additional components such as PWM outputs, analog-to-digital converters (ADCs), and multiple communication interfaces. These capabilities make the DSPIC30F3011-30I/P highly suitable for complex digital signal control and management tasks where precision and efficiency are paramount. Furthermore, its compatibility with a wide operating voltage range enhances its adaptability to different power setups, ensuring reliable performance across various application conditions.

DSPIC30F3011-30I/P Applications

  • Automotive Control Systems: Utilizes its high-speed ADCs and PWM outputs for managing engine functions, ensuring optimal vehicle performance and fuel efficiency.
  • Industrial Automation: Employs its robust I/O capabilities to oversee process controls in manufacturing settings, optimizing operational workflows and machinery efficiency.
  • Consumer Electronics: Ideal for integration into smart home devices, leveraging its processing power for seamless device interoperability and enhanced user experiences.
  • Telecommunication Infrastructure: Supports telecommunication systems by processing multiple data channels simultaneously, ensuring stable and efficient communication links.
  • Medical Devices: In medical applications, its precision and reliability support the functionalities of diagnostic equipment and patient monitoring systems.
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