DIP318-011BLF
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- Mfr.Part #
- DIP318-011BLF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 18POS GOLD
- Stock
- 3,612
- In Stock ：
- 3,612
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- IC Sockets
- Height :
- 4.19mm
- Termination Post Length :
- 0.125 3.18mm
- Published :
- 2007
- Body Depth :
- 0.165 inch
- Number of Pins :
- 18
- Mounting Type :
- Through Hole
- Contact Material :
- Copper
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Length :
- 22.9mm
- RoHS Status :
- RoHS Compliant
- Contact Material - Post :
- Brass
- Packaging :
- Tube
- Termination :
- Solder
- Pitch - Mating :
- 0.100 2.54mm
- Feature :
- Open Frame
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- Contact Style :
- RND PIN-SKT
- Mount :
- Through Hole
- Contact Finish - Mating :
- Gold
- Flammability Rating :
- UL94 V-0
- HTS Code :
- 8536.69.40.40
- ECCN Code :
- EAR99
- Pitch - Post :
- 0.100 2.54mm
- Mating Contact Pitch :
- 0.1 inch
- Type :
- DIP, 0.3 (7.62mm) Row Spacing
- Terminal Pitch :
- 2.54mm
- Body Breadth :
- 0.4 inch
- PCB Contact Row Spacing :
- 0.3 mm
- Contact Finish - Post :
- Tin
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- PCB Contact Pattern :
- RECTANGULAR
- Material Flammability Rating :
- UL94 V-0
- Lead Length :
- 3.175mm
- Number of Contacts :
- 18
- Contact Material - Mating :
- BERYLLIUM COPPER
- JESD-609 Code :
- e3
- Width :
- 10.2mm
- Datasheets
- DIP318-011BLF
DIP318-011BLF Documents
DIP318-011BLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available at Xinshop
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