DIP316-001BLF
- Mfr.Part #
- DIP316-001BLF
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 16POS GOLD
- Stock
- 21,802
- In Stock :
- 21,802
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- IC Sockets
- Type :
- DIP, 0.3 (7.62mm) Row Spacing
- Body Breadth :
- 0.4 inch
- Mounting Type :
- Through Hole
- Contact Material - Post :
- Brass
- Insulation Material :
- Polychlorinated
- Termination :
- Solder
- Feature :
- Open Frame
- Published :
- 2007
- Number of Rows :
- 2
- Connector Type :
- DIP, Socket
- Row Spacing :
- 7.62 mm
- Mount :
- Through Hole
- Material Flammability Rating :
- UL94 V-0
- Length :
- 20.32mm
- Termination Post Length :
- 0.125 3.18mm
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Depth :
- 10.16mm
- Pitch - Post :
- 0.100 2.54mm
- Packaging :
- Tube
- Contact Finish - Post :
- Tin
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Orientation :
- Straight
- Contact Material :
- Copper
- Pbfree Code :
- yes
- Pitch - Mating :
- 0.100 2.54mm
- Number of Contacts :
- 16
- Flammability Rating :
- UL94 V-0
- HTS Code :
- 8536.69.40.40
- PCB Contact Pattern :
- RECTANGULAR
- RoHS Status :
- RoHS Compliant
- Mating Contact Pitch :
- 0.1 inch
- Number of Positions or Pins (Grid) :
- 16 (2 x 8)
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Width :
- 10.2mm
- ECCN Code :
- EAR99
- Contact Finish - Mating :
- Gold
- Lead Length :
- 3.175mm
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- Contact Style :
- RND PIN-SKT
- Contact Material - Mating :
- BERYLLIUM COPPER
- JESD-609 Code :
- e4
- Datasheets
- DIP316-001BLF
DIP316-001BLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available at Xinshop
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