DF58-3P-1.2V(21)
- Mfr.Part #
- DF58-3P-1.2V(21)
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 3POS 1.2MM
- Stock
- 18,280
- In Stock :
- 18,280
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- Manufacturer :
- Hirose
- Product Category :
- Headers, Male Pins
- Insulation Height :
- 0.095 2.41mm
- Contact Finish - Mating :
- Tin
- RoHS Status :
- RoHS Compliant
- Termination :
- Solder
- Connector Type :
- Header
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Contact Material :
- COPPER ALLOY
- Pitch - Mating :
- 0.047 1.20mm
- ECCN Code :
- EAR99
- Shrouding :
- Unshrouded
- Number of Positions Loaded :
- All
- Insulation Color :
- Black
- Fastening Type :
- Swing Lock
- Voltage - Rated :
- 100Vdc
- Contact Shape :
- RECTANGULAR
- Number of Rows :
- 1
- Style :
- Board to Cable/Wire
- Number of Positions :
- 3
- Reach Compliance Code :
- Unknown
- Material Flammability Rating :
- UL94 V-0
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Contact Type :
- Male Blade
- Packaging :
- Tape and Reel (TR)
- Operating Temperature :
- -55°C~85°C
- Feature :
- Solder Retention
- Mounting Type :
- Surface Mount
- Series :
- DF58
- Pbfree Code :
- yes
- Factory Lead Time :
- 10 Weeks
- Datasheets
- DF58-3P-1.2V(21)

DF58 Series 1-Row Header Solder Copper Alloy Tape & Reel (TR) Surface Mount Tin Liquid Crystal Polymer (LCP) 3-Position Board to Cable/Wire 0.095 2.41mm Height
DF58-3P-1.2V(21) Overview
Packaging is in the form of Header.This device has a Surface Mount mounting type.An orange Tape & Reel (TR) case is used to package the product.Specifically, it is one of the products in the DF58 Series.Several benefits come from the Solder Retention feature.Devices operate at -55°C~85°C operating temperatures.
DF58-3P-1.2V(21) Features
DF58 series
DF58-3P-1.2V(21) Applications
There are a lot of Hirose Electric Co Ltd
DF58-3P-1.2V(21) Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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