DF13B-3P-1.25V(76)
- Mfr.Part #
- DF13B-3P-1.25V(76)
- Manufacturer
- Hirose
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 3POS 1.25MM
- Stock
- 228
- In Stock :
- 228
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- Manufacturer :
- Hirose
- Product Category :
- Headers, Male Pins
- Contact Finish Thickness - Post :
- 8.00μin 0.203μm
- Insulation Color :
- Beige
- Contact Shape :
- Square
- Number of Positions Loaded :
- All
- RoHS Status :
- RoHS Compliant
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Style :
- Board to Cable/Wire
- Contact Type :
- Male Pin
- Voltage - Rated :
- 150V
- Number of Positions :
- 3
- Shrouding :
- Shrouded - 3 Wall
- Current Rating (Amps) :
- 1A
- Packaging :
- Tube
- Contact Finish - Mating :
- Gold
- Fastening Type :
- Detent Lock
- Termination :
- Solder
- Number of Rows :
- 1
- Operating Temperature :
- -35°C~85°C
- Contact Material :
- Brass
- Insulation Height :
- 0.189 4.80mm
- Connector Type :
- Header
- Pitch - Mating :
- 0.049 1.25mm
- Material Flammability Rating :
- UL94 V-0
- Contact Finish Thickness - Mating :
- 8.00μin 0.203μm
- Feature :
- Board Guide, Solder Retention
- Insulation Material :
- Polyamide (PA), Nylon
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Series :
- DF13
- Datasheets
- DF13B-3P-1.25V(76)
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DF13 Series 1-Row Header Solder Brass Tube Surface Mount Gold Polyamide (PA), Nylon 3-Position Board to Cable/Wire 0.189 4.80mm Height
DF13B-3P-1.25V(76) Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the DF13 Series of products.A number of features make it more powerful because of its Board Guide, Solder Retention feature.There is no operating temperature for the device.
DF13B-3P-1.25V(76) Features
DF13 series
DF13B-3P-1.25V(76) Applications
There are a lot of Hirose Electric Co Ltd
DF13B-3P-1.25V(76) Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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