CYV15G0403DXB-BGI

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Mfr.Part #
CYV15G0403DXB-BGI
Manufacturer
Infineon Technologies
Package / Case
256-LBGA Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 256BGA
Stock
100
In Stock :
100

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Terminal Finish :
Tin/Lead (Sn/Pb)
Base Part Number :
CY*15G04
Packaging :
Tray
Mount :
Surface Mount
Series :
HOTlink II™
Terminal Pitch :
1.27mm
Qualification Status :
Not Qualified
Voltage - Supply :
3.135V~3.465V
Nominal Supply Current :
1.32A
Interface :
LVTTL
Package / Case :
256-LBGA Exposed Pad
JESD-609 Code :
e0
Width :
27mm
Length :
27mm
Operating Supply Voltage :
3.3V
Number of Circuits :
4
Operating Temperature :
-40°C~85°C
Number of Terminations :
256
Published :
2003
Terminal Position :
BOTTOM
Current - Supply :
900mA
Function :
Transceiver
Mounting Type :
Surface Mount
Data Rate :
1500000 Mbps
Number of Transceivers :
4
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
3.3V
Reach Compliance Code :
not_compliant
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
30
Number of Pins :
256
Peak Reflow Temperature (Cel) :
225
Datasheets
CYV15G0403DXB-BGI
Introducing Telecom Infineon Technologies CYV15G0403DXB-BGI from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:CY*15G04, Package / Case:256-LBGA Exposed Pad, Operating Temperature:-40°C~85°C, Number of Terminations:256, Mounting Type:Surface Mount, Number of Pins:256, CYV15G0403DXB-BGI pinout, CYV15G0403DXB-BGI datasheet PDF, CYV15G0403DXB-BGI amp .Beyond Telecom Infineon Technologies CYV15G0403DXB-BGI ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYV15G0403DXB-BGI


Telecom Infineon Technologies CYV15G0403DXB-BGI Overview

The Infineon Technologies CYV15G0403DXB-BGI IC is a state-of-the-art telecom interface chip, designed to deliver reliable, high-speed performance in complex telecommunications infrastructure equipment. As an integral component of modern telecom networks, this IC enhances data transmission capabilities and improves overall system efficiency with its advanced design and Infineon's cutting-edge technology. Its compact 256 BGA package ensures a reduced footprint while maintaining robust functionality, making the Telecom Infineon Technologies CYV15G0403DXB-BGI a perfect choice for high-demand applications that require durability and precision.

CYV15G0403DXB-BGI Features

The CYV15G0403DXB-BGI features include high-speed data interfaces, low power consumption, and advanced signal integrity tools which are crucial for managing complex data streams in telecom networks. Additionally, its enhanced security protocols provide robust protection against a variety of digital threats, ensuring reliable and secure communications.

CYV15G0403DXB-BGI Applications

  • Telecommunications Networks: Utilized in switches and routers to manage data flow efficiently across networks.
  • Mobile Base Stations: Enhances the reliability and efficiency of data transmission between the base station and mobile devices.
  • Broadband Access Systems: Critical in broadband modems and access devices, facilitating faster data rates and improved connectivity.
  • Network Interface Cards: Used in the fabrication of NICs to provide faster and more reliable network communications.
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