CYV15G0101DXB-BBXI

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Mfr.Part #
CYV15G0101DXB-BBXI
Manufacturer
Infineon Technologies
Package / Case
100-LBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 100TBGA
Stock
38,774
In Stock :
38,774

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Terminal Position :
BOTTOM
Function :
Transceiver
Current - Supply :
390mA
Mount :
Surface Mount
Qualification Status :
Not Qualified
Terminal Form :
Ball
Number of Terminations :
100
Peak Reflow Temperature (Cel) :
260
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Lead Free :
Lead Free
Number of Channels :
1
Nominal Supply Current :
510mA
Packaging :
Tray
Telecom IC Type :
INTERFACE CIRCUIT
Supply Voltage :
3.3V
Voltage - Supply :
3.135V~3.465V
Number of Transceivers :
1
Time@Peak Reflow Temperature-Max (s) :
20
Operating Supply Voltage :
3.3V
Mounting Type :
Surface Mount
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Series :
HOTlink II™
Reach Compliance Code :
Unknown
Package / Case :
100-LBGA
Operating Temperature :
-40°C~85°C
Published :
2005
RoHS Status :
ROHS3 Compliant
Base Part Number :
CY*15G01
Interface :
LVTTL
Number of Pins :
100
Introducing Telecom Infineon Technologies CYV15G0101DXB-BBXI from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:100, Number of Channels:1, Mounting Type:Surface Mount, Package / Case:100-LBGA, Operating Temperature:-40°C~85°C, Base Part Number:CY*15G01, Number of Pins:100, CYV15G0101DXB-BBXI pinout, CYV15G0101DXB-BBXI datasheet PDF, CYV15G0101DXB-BBXI amp .Beyond Telecom Infineon Technologies CYV15G0101DXB-BBXI ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYV15G0101DXB-BBXI


Telecom Infineon Technologies CYV15G0101DXB-BBXI Overview

Introducing the CYV15G0101DXB-BBXI, a state-of-the-art IC Telecom Interface from Infineon Technologies, designed to cater to the sophisticated needs of modern telecommunication systems. As a pivotal component in the field of telecom interfacing, this IC facilitates robust data transmission capabilities across various network architectures. The device is housed in a 100TBGA package, ensuring compact integration and enhanced performance reliability. Ideal for B2B clients looking to leverage advanced telecom technology, the Telecom Infineon Technologies CYV15G0101DXB-BBXI offers unparalleled efficiency and functionality, making it an essential pick for bulk purchasing.

CYV15G0101DXB-BBXI Features

  • Compact 100TBGA package for simplified system integration
  • High-speed data transmission capabilities suitable for advanced telecommunications
  • Robust design engineered for reliability and performance in critical communications
  • Developed by Infineon Technologies, a leader in semiconductor solutions

CYV15G0101DXB-BBXI Applications

  • High-Speed Networks: Enhances data throughput and reliability in backbone network infrastructures.
  • Telecommunications Equipment: Integral for modems, switches, and routers, providing efficient interfacing solutions.
  • Wireless Infrastructure: Supports robust wireless communication systems, including base station development.
  • Consumer Electronics: Used in high-performance consumer communication devices, ensuring high-speed data exchange and connectivity.
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