CYV15G0401DXB-BGC
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- Mfr.Part #
- CYV15G0401DXB-BGC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 256BGA
- Stock
- 28,856
- In Stock ：
- 28,856
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Current - Supply :
- 870mA
- Mount :
- Surface Mount
- Nominal Supply Current :
- 1.06A
- Number of Transceivers :
- 4
- Series :
- HOTlink II™
- Base Part Number :
- CY*15G04
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1.27mm
- Operating Temperature :
- 0°C~70°C
- JESD-609 Code :
- e0
- Terminal Form :
- Ball
- Published :
- 2005
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Length :
- 27mm
- Package / Case :
- 256-LBGA Exposed Pad
- Number of Terminations :
- 256
- Number of Circuits :
- 4
- Supply Voltage :
- 3.3V
- Voltage - Supply :
- 3.135V~3.465V
- Reach Compliance Code :
- not_compliant
- Function :
- Transceiver
- Width :
- 27mm
- Operating Supply Voltage :
- 3.3V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Number of Pins :
- 256
- Peak Reflow Temperature (Cel) :
- 225
- Data Rate :
- 1500000 Mbps
- Interface :
- LVTTL
- Datasheets
- CYV15G0401DXB-BGC
Telecom Infineon Technologies CYV15G0401DXB-BGC Overview
The Infineon Technologies CYV15G0401DXB-BGC is a high-performance IC telecom interface designed for demanding telecommunications applications. This 256-ball BGA (Ball Grid Array) device is engineered to facilitate robust data and voice communications. Its integration capabilities make it ideal for developers seeking to enhance system reliability and performance in telecom infrastructure. The Telecom Infineon Technologies CYV15G0401DXB-BGC offers an optimal solution for managing complex communications protocols and signal integrity, thus ensuring superior performance in a variety of telecom setups.
CYV15G0401DXB-BGC Features
The CYV15G0401DXB-BGC IC features advanced interface technology that supports various telecommunications standards, ensuring compatibility and high-performance across multiple platforms. It also boasts low power consumption and minimized latency, making it suitable for high-speed telecom operations. The compact 256BGA packaging allows for efficient use of board space, which is critical in modern telecom equipment designs.
CYV15G0401DXB-BGC Applications
- High-Speed Networks: Utilized in routers and switches to manage data flow efficiently, enhancing network reliability and speed.
- Wireless Base Stations: Key component in base stations for mobile communication, enabling robust signal processing capabilities that are crucial for 4G/LTE and emerging 5G networks.
- Optical Transport Networks: Employs advanced signal integrity features to support high-bandwidth data transmission in fiber-optic communications.
- Network Interface Cards: Used in NICs to provide reliable and high-speed connectivity solutions, crucial for server and storage applications in data centers.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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