CY9BF316NBGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

Packaging :

Tray

Core Size :

32-Bit

Mounting Type :

Surface Mount

Length :

10mm

External Data Bus Width :

16

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Surface Mount :

yes

Core Processor :

ARM® Cortex®-M3

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Program Memory Size :

544KB 544K x 8

JESD-30 Code :

S-PBGA-B112

Supply Voltage-Max (Vsup) :

5.5V

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

DAC Channels :

No

Supply Voltage :

4.5V

Connectivity :

CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB

RoHS Status :

ROHS3 Compliant

Series :

FM3 MB9B310R

Has ADC :

yes

Operating Temperature :

-40°C~85°C TA

Peripherals :

DMA, LVD, POR, PWM, WDT

Terminal Position :

BOTTOM

Oscillator Type :

Internal

DMA Channels :

yes

RAM (bytes) :

65536

Terminal Form :

Ball

Speed :

144MHz

Number of I/O :

83

On Chip Program ROM Width :

8

Terminal Pitch :

0.8mm

Clock Frequency :

48MHz

Package / Case :

112-LFBGA

PWM Channels :

yes

Width :

10mm

Height Seated (Max) :

1.45mm

Supply Voltage-Min (Vsup) :

2.7V

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Number of Terminations :

112

Address Bus Width :

25

Factory Lead Time :

19 Weeks

ROM (words) :

557056

Data Converter :

A/D 16x12b

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Program Memory Type :

Flash

Bit Size :

32

RAM Size :

64K x 8