CY9BF306NBBGL-GK6E1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

External Data Bus Width :

16

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Has ADC :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Factory Lead Time :

20 Weeks

Number of Terminations :

112

PWM Channels :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

ROM (words) :

524288

Operating Temperature :

-40°C~85°C TA

Oscillator Type :

Internal

Terminal Pitch :

0.8mm

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

RAM (bytes) :

65536

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Position :

BOTTOM

On Chip Program ROM Width :

8

RoHS Status :

ROHS3 Compliant

Number of I/O :

80

Mounting Type :

Surface Mount

Peripherals :

DMA, LVD, POR, PWM, WDT

DAC Channels :

No

Terminal Form :

Ball

Core Size :

32-Bit

Width :

10mm

Supply Voltage :

4.5V

Core Processor :

ARM® Cortex®-M3

JESD-30 Code :

S-PBGA-B112

Data Converter :

A/D 16x12b

DMA Channels :

yes

Packaging :

Tray

Series :

FM3 MB9B300B

Address Bus Width :

25

Surface Mount :

yes

Connectivity :

CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB

Clock Frequency :

48MHz

Supply Voltage-Min (Vsup) :

2.7V

Speed :

80MHz

Package / Case :

112-LFBGA

RAM Size :

64K x 8

Supply Voltage-Max (Vsup) :

5.5V

Bit Size :

32

Length :

10mm

Height Seated (Max) :

1.45mm

Program Memory Size :

512KB 512K x 8

Program Memory Type :

Flash