CY9BF112NBGL-GE1

Manufacturer :

Infineon Technologies

Product Category :

Microcontrollers

DMA Channels :

yes

ROM (words) :

163840

Peripherals :

DMA, LVD, POR, PWM, WDT

Packaging :

Tray

Program Memory Type :

Flash

On Chip Program ROM Width :

8

Number of Terminations :

112

Speed :

144MHz

Data Converter :

A/D 16x12b

Factory Lead Time :

19 Weeks

Length :

10mm

JESD-30 Code :

S-PBGA-B112

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

112-LFBGA

RoHS Status :

ROHS3 Compliant

Supply Voltage-Min (Vsup) :

2.7V

Terminal Form :

Ball

PWM Channels :

yes

Bit Size :

32

Terminal Position :

BOTTOM

Series :

FM3 MB9B110R

RAM Size :

16K x 8

Surface Mount :

yes

Terminal Pitch :

0.8mm

Height Seated (Max) :

1.45mm

Operating Temperature :

-40°C~85°C TA

Has ADC :

yes

Mounting Type :

Surface Mount

Width :

10mm

Core Processor :

ARM® Cortex®-M3

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Voltage :

4.5V

Connectivity :

CSIO, EBI/EMI, I2C, LINbus, UART/USART

RAM (bytes) :

16384

External Data Bus Width :

16

Number of I/O :

83

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

DAC Channels :

No

Clock Frequency :

48MHz

Program Memory Size :

160KB 160K x 8

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Supply Voltage-Max (Vsup) :

5.5V

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Core Size :

32-Bit

Oscillator Type :

Internal

Address Bus Width :

25